Mechanical Specifications; Package Dimensions - Compaq 21264 Hardware Reference Manual

Compaq microprocessor reference manual
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3.4

Mechanical Specifications

This section shows the 21264/EV67 mechanical package dimensions without a heat
sink. For heat sink information and dimensions, refer to Chapter 10.
Figure 3–2 shows the package physical dimensions without a heat sink.
Figure 3–2 Package Dimensions
B
BE
BD
BC
BC
BB
BA
AY
AW
AV
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
02
04 06 08 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44
01
03
05
07
09
11
13
15
17
19
21
59.94 mm (2.360 in) Typ
29.62 mm
(1.180 in) Typ
25.40 mm
(1.000 in) Typ
53.85 mm
(2.120 in) Typ
Alpha 21264/EV67 Hardware Reference Manual
2.54 mm (.100 in) Typ
Standoff (4x)
587x 1.40 mm (.055 in) Typ
1.27 mm (.050 in) Typ
27.94 mm
(1.100 in)
23
25
27
29
31
33
35
37
39
41
43
45
27.94 mm
(1.100 in)
29.62 mm
(1.180 in) Typ
Mechanical Specifications
1.27 mm (.050 in) Typ
4.32 mm (.170 in) Typ
1.377 mm (.055 in) Typ
Lid
1/4-20 Stud (2x)
7.62 mm (.300 in) Typ
.13 mm
(.005 in) R
1.905 mm (.075 in) Typ
Hardware Interface
FM-05662.AI4
3–17

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