Thermal Design Considerations - Compaq 21264 Hardware Reference Manual

10.3 Thermal Design Considerations

Follow these guidelines for printed circuit board (PCB) component placement:
•
Orient the 21264/EV67 on the PCB with the heat sink fins aligned with the airflow
direction.
•
Avoid preheating ambient air. Place the 21264/EV67 on the PCB so that inlet air is
not preheated by any other PCB components.
•
Do not place other high power devices in the vicinity of the 21264/EV67.
Do not restrict the airflow across the 21264/EV67 heat sink. Placement of other devices
must allow for maximum system airflow in order to maximize the performance of the
heat sink.
Alpha 21264/EV67 Hardware Reference Manual
Thermal Design Considerations
Thermal Management
10–7