Table of Contents
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This chapter describes the 21264/EV68A thermal management and thermal design
considerations, and is organized as follows:
•
Operating temperature
•
Heat sink specifications
•
Thermal design considerations
10.1 Operating Temperature
The 21264/EV68A is specified to operate when the temperature at the center of the heat
sink (T
c)
the heat sink, between the two package studs. The GRAFOIL pad is the interface mate-
rial between the package and the heat sink.
Table 10–1 Operating Temperature at Heat Sink Center
T
c
80.8 C
78.6 C
77.6 C
76.0 C
Note:
21264/EV68A Hardware Reference Manual
is as shown in Table 10–1. Temperature T
Frequency
750 MHz
833 MHz
875 MHz
940 MHz
Compaq recommends using the heat sink because it reduces overheating
that causes thermal failure.
Thermal Management
should be measured at the center of
c
(T
)
c
Thermal Management
10
10–1
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