Object Data; Trigger Condition - Mitsubishi Electric MELSEC iQ-R-R00CPU User Manual

Melsec iq-r series cpu module application user's manual
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Object data

This section describes the data to be collected by memory dump.
Data to be collected
Of the devices listed below, all devices that are within the range specified in the device settings are subject to the collection.
Type
Bit device
Word device
Double-word device
*1 Includes local devices as well. Note that to the memory dump file, the program names of collected local devices are output.
*2 All file registers that exist in the device/label memory are collected.
*3 The CPU module where the SFC function can be used supports this device. ( Page 1008 Added and Enhanced Functions)

Trigger condition

The following table lists the conditions to be used as a trigger. Set the trigger condition in the memory dump settings. ( GX
Works3 Operating Manual)
Trigger condition
Device specification
Error code specification
• On the occurrence of consecutive triggers, if the status of data save due to the previous occurrence of
trigger is "Save complete" of collected data, the next trigger is recognized as a trigger again. Note that
events other than the above are not recognized as a trigger condition.
• A trigger can be generated with trigger conditions combined. ( Page 224 Combining trigger conditions)
Device specification
Data are collected when the specified monitoring target data (bit data) turns on during the END processing. Even though the
value of the monitoring target data changes during a single scan, if the value during the END processing is same as that
during the last END processing, it is not recognized as a trigger. Completion bits (including error completion bits) used in
dedicated instructions cannot be used as a trigger.
Data condition
Program
For monitoring data, the following devices can be specified.
Type
Bit device
*2
Word device
*1 A local device, index modified device, and indirectly specified device cannot be specified.
*2 Word devices allow bit specification only.
*3 In the engineering tool, specify TS as T (contact), STS as ST (contact), CS as C (contact), LTS as LT (contact), LSTS as LST (contact),
and LCS as LC (contact).
12 DEBUG FUNCTION
222
12.1 Memory Dump Function
*1
Device
X, Y, M, L, B, F, SB, V, T (contact), T (coil), LT (contact), LT (coil), ST (contact), ST (coil), LST (contact), LST (coil), C (contact),
C (coil), LC (contact), LC (coil), FX, FY, SM, BLn\S
T (current value), ST (current value), C (current value), D, W, SW, FD, SD, R
LT (current value), LST (current value), LC (current value), LZ
Description
Data are collected when the specified monitoring target data (bit data) turns on during the END processing.
Data are collected when an error occurs in the specified CPU module.
END
1 scan
Data sampling starts.
*1
Device
X, Y, M, L, F, SM, V, B, SB, T (contact)
D, SD, W, SW, R, ZR, FD, RD
*3
Trigger occurrence
END
*3
*3
*3
, ST (contact)
, C (contact)
*2
*2
, ZR
, Z, RD
*3
*3
, LT (contact)
, LST (contact)
, LC (contact)
*3
, FX, FY

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