Component Placement And Routing Priorities - Analog Devices ADRV9001 User Manual

Reference Manual
PRINTED CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Figure 251. Trace Fan-Out Scheme on ADRV9001 Evaluation Card (PCB Layer TOP and Layer 8 Enabled)

COMPONENT PLACEMENT AND ROUTING PRIORITIES

The ADRV9001 transceiver requires a few external components to function, and the ones needed require careful placement and routing to
optimize performance. This section provides a priority order and checklist to properly place and route critical signals and components, as well
as those whose location and isolation are not as critical.
Board layout design involves compromise. The recommendations in this section are intended for wide RF bandwidth applications. For narrow
RF bandwidth applications, the board line impedance parameters within this document may not be optimal.
The following list provides general suggestions for board design:
Match the customer board design as close as possible to the ADRV9001 board design.
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Be attentive to power distribution and power ground return methodology.
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Do not run high-speed digital lines close to the DC power distribution routes or RF line routes.
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Signals with Highest Routing Priority
RF lines and DEV_CLK clock are the most critical signals. Route these with the highest priority.
route each signal so that are properly isolated from noisy signals.
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Figure 252 shows the general directions to
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