6.4 Mechanical Drawing
Figure 6.15 329-Pad Plastic Ball Grid Array
Important:
This drawing may not be the latest version. For board layout and manufacturing, obtain the
most recent engineering drawings from your LSI Logic marketing representative by
requesting the outline drawing for package code BL.
6-26
Figure 6.15
shows the mechanical drawing for the 329-pad BGA.
Specifications
Copyright © 2000, 2001 by LSI Logic Corporation. All rights reserved.