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6.5 Package Thermal Considerations
Table 6.17
Maximum Allowable Ambient Temperature vs. Airflow
Airflow
(cfm)
With
Heat Sink
Without
Heat Sink
Thermal management is an important element of electronic product
design. In any system environment, it is important not to exceed the
maximum recommended semiconductor junction temperature. The
maximum recommended junction temperature for the LSIFC929 is
115 ˚C.
To that end, LSI Logic recommends that the customer use an appropriate
heat sink for the LSIFC929, and that adequate airflow exists throughout
the system.
Allowing for a maximum dynamic power consumption of 4 W, Table 6.15
below shows some examples of the maximum allowable junction
temperature to maintain less than a 70 ˚C ambient for the given airflow
and heat sink conditions.
θ
JAmax
(˚C/W)
0
12.2
200
8.4
300
6.8
600
6.0
0
16.6
200
14.0
300
13.2
600
12.4
Package Thermal Considerations
Copyright © 2000, 2001 by LSI Logic Corporation. All rights reserved.
Junction Temperature
at 70 ˚C Ambient (˚C)
118.8
103.6
97.2
94.0
136.4
126.0
122.8
119.6
Maximum Allowable
Ambient Temperature (˚C)
66.2
81.4
87.8
91.0
48.6
59.0
62.2
65.4
6-27
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