Appendix F Package Dimensions - Renesas H8S/2319 series Hardware Manual

Renesas 16-bit single-chip microcomputer
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76
100
*0.22 ± 0.05
0.20 ± 0.04
*
Dimension including the plating thickness
Base material dimension
Rev. 5.00, 12/03, page 1086 of 1088

Appendix F Package Dimensions

16.0 ± 0.2
14
75
51
50
26
1
25
M
0.08
1.0
0.10
Figure F-1 TFP-100B Package Dimensions
As of January, 2003
1.0
0.5 ± 0.1
Package Code
JEDEC
JEITA
Mass (reference value)
Unit: mm
0° – 8°
TFP-100B
Conforms
0.5 g

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