Agilent Technologies 8453 Operator's Manual page 132

Theory of Operation
Instrument Layout and Construction
Instrument Layout and Construction
The industrial design of the spectrophotometer incorporates several
innovative features. It uses the E-Pak concept for the packaging of
electronics and mechanical assemblies. This concept is based upon the use
of layers foam plastic spacers in which the electronic boards of the
spectrophotometer are placed. This pack is then housed in a metal internal
cabinet which is enclosed by a plastic external cabinet. The advantages of
this packaging technology are:
• the plastic layers have air channels molded in them so that cooling air can
be guided exactly to the required locations,
• the plastic layers help cushion the electronical and mechanical parts from
physical shock, and
• the metal inner cabinet shields the internal electronics from
electromagnetic interference and also helps to reduce or eliminate radio
frequency emissions from the instrument itself.
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