Figure 40. Sdh Ho Matrix Board Implementation - Alcatel 1850 TSS-320 Technical Handbook

3.4.1.2 SDH Higher Order Matrix board
The SDH Higher Order Matrix is implemented in the matrix board of the equipment, by means of the
payload agnostic switching device, able to switch both TDM and data traffic.
The device is able to provide switching capabilities at MSP and VC-n level: Both MSPC (Multiplex Section
Protection Connection) and HPC (Higher Order Path Connection) switching functions are in fact collapsed
in the device.
See section 3.3 on page 70 for maximum switching capability of HO matrix.
3.4.1.2.1 SDH HO matrix physical representation
The corresponding functional model of the matrix board is depicted in Figure 40. on page 76.
The statuses of MSPC and HPC connection functions are individually calculated, as if they were two
physical entities.
The switching command is then derived correlating MSPC status and HPC status.
• MSPC (not operative in current release) connection function status is determined in order to
provide protection for the STM-N signal against channel-associated failures within a multiplex
section, by using the bit-oriented protocol defined for the MSP bytes K1, K2 and optionally K0.
Under failure condition in Rx direction valid data are no longer taken from the working line
termination but from the spare one; the required switch operation for MSP protection does not
involve HPC. Similarly in Tx direction the MSPC status is such to guarantee data forking to both
working and spare lines.
Type of connection:
• unprotected,
• 1+1 protected by means of linear MSP protection
• 1:N protected by means of linear MSP protection
• protected by means of MS-SPRING
Alcatel 1850 TSS-320 Rel. 1.1
76/270 8DG 07734 AAAA Edition 01
MATRIX CARD
MSnP + Sn

Figure 40. SDH HO matrix board implementation

Technical Handbook Common
Functional Description