Section 21 Recommended Reflow Condition - Hitachi HD64465 User Manual

Section 21 Recommended Reflow Condition

248
222
196
170
144
118
92 1
66
Limits for IR Reflow Profile Characteristics of Package Leads
Characteristics #
1
2
3
4
5
6
Note: Devices classified as moisture sensitive should limit maximum body temperature to 220°C.
2
53 106 159
Lead Soldering Profile in the IR Oven
Characteristic Description
Initial Heating Rate of Leads
Peak Lead Temperature in Preheat Zone
Time above 150°C
Time above 183°C
(63 / 37 Tin / Lead Paste Melting Point)
Peak Reflow Lead Temperature*
Cooling rate of lead
3
212 265 318
Time (seconds)
Rev. 3.0, 03/01, page 365 of 390
5
6
4
371 424 477
Limits
0.8-1.2°C / Sec.
125°C±20°C
400 Secs Max
Max-150 sec.
215 ±5°C
Max 4°C / Sec.