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THERMAL SPECIFICATIONS AND DESIGN CONSIDERATIONS
cover the location specified for T
attached at a 0° angle (refer to Figure 10-3).
2.673
Measure from edge of thermal plate.
1.089
Recommended location of
thermal grease application.
All dimensions in inches.
Figure 10-2. Processor Thermal Plate Temperature Measurement Location
Figure 10-3. Technique for Measuring T
10-4
PLATE
Measure T
at this point.
Approx. location for
recommended
heatsink attachment.
0.35 R
measurement, the thermocouple should be
Cover
PLATE
Substrate
with 0° Angle Attachment
PLATE
Processor
Core
000874b
000899
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