Thermal Solution Attach Methods - Intel Pentium II Developer's Manual

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THERMAL SPECIFICATIONS AND DESIGN CONSIDERATIONS
0.8
0.8
1.0
1.0
1.31
2.8
Edge near Slot 1 connector
000966
Figure 10-5. Guideline Locations for Cover Temperature (T
)
COVER
Thermocouple Placement

10.3. THERMAL SOLUTION ATTACH METHODS

The design of the thermal plate is intended to support two different attach methods —
heatsink clips and Rivscrews*. Figure 11-4 and Figure 11-6 show the thermal plate and the
locations of the attach features. Figure 10-6 shows the mechanical design space for all
heatsink attach solutions. Only one attach method should be used for any thermal solution.
10-6

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