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Xeon 3500 Series
Intel Xeon 3500 Series Manuals
Manuals and User Guides for Intel Xeon 3500 Series. We have
2
Intel Xeon 3500 Series manuals available for free PDF download: Datasheet, Design Manual
Intel Xeon 3500 Series Datasheet (106 pages)
Brand:
Intel
| Category:
Computer Hardware
| Size: 2 MB
Table of Contents
Table of Contents
3
Revision History
7
1 Introduction
9
High-Level View of Processor Interfaces
9
Terminology
10
References
11
2 Electrical Specifications
13
Intel® QPI Differential Signaling
13
Power and Ground Lands
13
Decoupling Guidelines
13
Active ODT for a Differential Link Example
13
VCC, VTTA, VTTD, VDDQ Decoupling
14
Processor Clocking (BCLK_DP, BCLK_DN)
14
PLL Power Supply
14
Voltage Identification (VID)
14
Voltage Identification Definition
15
Reserved or Unused Signals
17
Market Segment Selection Truth Table for MS_ID[2:0]
17
Signal Groups
18
Test Access Port (TAP) Connection
19
Signals with ODT
19
Platform Environmental Control Interface (PECI) DC Specifications
20
DC Characteristics
20
PECI DC Electrical Limits
20
Input Device Hysteresis
21
Absolute Maximum and Minimum Ratings
21
Processor DC Specifications
22
Processor Absolute Minimum and Maximum Ratings
22
DC Voltage and Current Specification
23
Voltage and Current Specifications
23
VCC Static and Transient Tolerance Load Lines
25
VTT Static and Transient Tolerance Load Line
27
VTT Static and Transient Tolerance
27
DDR3 Signal Group DC Specifications
27
RESET# Signal DC Specifications
28
TAP Signal Group DC Specifications
28
PWRGOOD Signal Group DC Specifications
28
VCC Overshoot Specification
29
Control Sideband Signal Group DC Specifications
29
Die Voltage Validation
30
VCC Overshoot Example Waveform
30
3 Package Mechanical Specifications
31
Package Mechanical Drawing
31
Processor Package Assembly Sketch
31
Processor Package Drawing (Sheet 1 of 2)
32
Processor Package Drawing (Sheet 2 of 2)
33
Processor Component Keep-Out Zones
34
Package Loading Specifications
34
Package Handling Guidelines
34
Package Insertion Specifications
34
Processor Loading Specifications
34
Processor Mass Specification
35
Processor Materials
35
Processor Markings
35
Processor Top-Side Markings
35
Processor Land Coordinates
36
Processor Land Coordinates and Quadrants (Bottom View)
36
4 Intel Xeon Processor 3500 Series Land Listing
37
Intel Xeon Processor 3500 Series Land Assignments
37
Land Listing by Land Name
38
Land Listing by Land Number
56
5 Signal Definitions
75
6 Thermal Specifications
79
Package Thermal Specifications
79
Processor Thermal Specifications
80
Processor Thermal Profile
81
Thermal Metrology
83
Thermal Test Vehicle (TTV) Case Temperature (TCASE) Measurement Location
83
Processor Thermal Features
84
Processor Temperature
84
Adaptive Thermal Monitor
84
Frequency and Voltage Ordering
86
THERMTRIP# Signal
87
Platform Environment Control Interface (PECI)
88
Introduction
88
PECI Specifications
89
Supported PECI Command Functions and Codes
89
Storage Conditions Specifications
90
Gettemp0() Error Codes
90
Storage Condition Ratings
90
7 Features
93
Power-On Configuration (POC)
93
Clock Control and Low Power States
93
Power on Configuration Signal Options
93
Thread and Core Power State Descriptions
94
Power States
94
Coordination of Thread Power States at the Core Level
94
Package Power State Descriptions
95
Sleep States
96
ACPI P-States (Intel Turbo Boost Technology)
96
Processor S-States
96
Enhanced Intel Speedstep Technology
97
8 Boxed Processor Specifications
99
Introduction
99
Mechanical Representation of the Boxed Processor
99
Mechanical Specifications
100
Boxed Processor Cooling Solution Dimensions
100
Space Requirements for the Boxed Processor (Side View)
100
Space Requirements for the Boxed Processor (Top View)
101
Space Requirements for the Boxed Processor (Overall View)
101
Boxed Processor Fan Heatsink Weight
102
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
102
Electrical Requirements
102
Fan Heatsink Power Supply
102
Boxed Processor Fan Heatsink Power Cable Connector Description
102
Thermal Specifications
103
Boxed Processor Cooling Requirements
103
Baseboard Power Header Placement Relative to Processor Socket
103
Fan Heatsink Power and Signal Specifications
103
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View)
104
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View)
104
Variable Speed Fan
105
Boxed Processor Fan Heatsink Set Points
105
Fan Heatsink Power and Signal Specifications
105
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Intel Xeon 3500 Series Design Manual (72 pages)
Thermal / Mechanical Design Guide
Brand:
Intel
| Category:
Computer Hardware
| Size: 3 MB
Table of Contents
Table of Contents
3
Revision History
6
1 Introduction
7
Processor Thermal Solution & LGA1366 Socket Stack
7
References
8
Definition of Terms
8
2 LGA1366 Socket
11
LGA1366 Socket with Pick and Place Cover Removed
11
LGA1366 Socket Contact Numbering (Top View of Socket)
12
Board Layout
13
LGA1366 Socket Land Pattern (Top View of Board)
13
Attachment to Motherboard
14
Socket Components
14
Socket Body Housing
14
Solder Balls
14
Contacts
15
Pick and Place Cover
15
Package Installation / Removal
16
Socket Standoffs and Package Seating Plane
16
Package Installation / Removal Features
16
Durability
17
Markings
17
Component Insertion Forces
17
Socket Size
17
LGA1366 Socket NCTF Solder Joints
18
LGA1366 NCTF Solder Joints
18
3 Independent Loading Mechanism (ILM)
19
Design Concept
19
ILM Cover Assembly Design Overview
19
ILM Back Plate Design Overview
20
Assembly of ILM to a Motherboard
20
ILM Cover Assembly
20
ILM Assembly
21
Pin1 and ILM Lever
22
4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
23
Component Mass
23
Package/Socket Stackup Height
23
Socket Maximum Temperature
23
Socket Component Mass
23
1366-Land Package and LGA1366 Socket Stackup Height
23
Loading Specifications
24
Electrical Requirements
24
Socket and ILM Mechanical Specifications
24
Environmental Requirements
25
Electrical Requirements for LGA1366 Socket
25
Flow Chart of Knowledge-Based Reliability Evaluation Methodology
26
5 Sensor Based Thermal Specification Design Guidance
27
Sensor Based Specification Overview
27
Sensor Based Thermal Specification
28
TTV Thermal Profile
28
Comparison of Case Temperature Vs. Sensor Based Specification
28
Specification When DTS Value Is Greater than TCONTROL
29
Thermal Profile
29
Thermal Solution Design Process
30
Boundary Condition Definition
30
Thermal Solution Performance
30
Thermal Design and Modelling
31
Required YCA for Various TAMBIENT Conditions
31
Thermal Solution Validation
32
Fan Speed Control (FSC) Design Process
33
Thermal Solution Performance Vs. Fan Speed
33
Fan Speed Control Algorithm Without TAMBIENT Data
34
Fan Response Without TAMBIENT Data
34
Fan Speed Control Algorithm with TAMBIENT Data
35
Fan Response with TAMBIENT Aware FSC
35
System Validation
36
Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL
37
6 ATX Reference Thermal Solution
39
Operating Environment
39
Processor Thermal Solution Requirements & Boundary Conditions
39
Heatsink Thermal Solution Assembly
40
ATX Heatsink Reference Design Assembly
40
Geometric Envelope for the Intel ® Reference ATX Thermal Mechanical Design
41
ATX KOZ 3-D Model Primary (Top) Side
41
Reference Design Components
42
Extrusion
42
RCBF5 Extrusion
42
Clip
43
RCBF5 Clip
43
Core
44
Mechanical Interface to the Reference Attach Mechanism
44
Clip Core and Extrusion Assembly
45
Critical Parameters for Interface to the Reference Clip
45
Heatsink Mass and Center of Gravity
46
Thermal Interface Material
46
Absolute Processor Temperature
46
Critical Core Dimensions
46
7 Thermal Solution Quality and Reliability Requirements
47
Reference Heatsink Thermal Verification
47
Mechanical Environmental Testing
47
Recommended Test Sequence
47
Post-Test Pass Criteria
48
Recommended Bios/Processor/Memory Test Procedures
48
Material and Recycling Requirements
48
A Component Suppliers
49
Reference Heatsink Enabled Components
49
LGA1366 Socket and ILM Components
49
A-3 Supplier Contact Information
49
B Mechanical Drawings
51
Mechanical Drawing List
51
Socket / Heatsink / ILM Keepout Zone Primary Side (Top)
52
Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom)
53
Socket / Processor / ILM Keepout Zone Primary Side (Top)
54
Socket / Processor / ILM Keepout Zone Secondary Side (Bottom)
55
Reference Design Heatsink Assembly (1 of 2)
56
B-6 Reference Design Heatsink Assembly (2 of 2)
57
B-7 Reference Fastener Sheet 1 of 4
58
B-8 Reference Fastener Sheet 2 of 4
59
B-9 Reference Fastener Sheet 3 of 4
60
B-10 Reference Fastener Sheet 4 of 4
61
B-11 Reference Clip - Sheet 1 of 2
62
B-12 Reference Clip - Sheet 2 of 2
63
C Socket Mechanical Drawings
65
Mechanical Drawing List
65
Socket Mechanical Drawing (Sheet 1 of 4)
66
Socket Mechanical Drawing (Sheet 2 of 4)
67
Socket Mechanical Drawing (Sheet 3 of 4)
68
Socket Mechanical Drawing (Sheet 4 of 4)
69
D Processor Installation Tool
71
Processor Installation Tool
72
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