Thermal Profile; Thermal Solution Design Requirements; Figure 2-2. Processor Case Temperature Measurement Location - Intel E6700 - Core 2 Duo Dual-Core Processor Design Manual

Mechanical design guidelines
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Processor Thermal/Mechanical Information

Figure 2-2. Processor Case Temperature Measurement Location

2.2.2

Thermal Profile

The Thermal Profile defines the maximum case temperature as a function of processor
power dissipation. Refer to the datasheet for the further information.
2.2.3

Thermal Solution Design Requirements

While the thermal profile provides flexibility for ATX /BTX thermal design based on its
intended target thermal environment, thermal solutions that are intended to function
in a multitude of systems and environments need to be designed for the worst-case
thermal environment. The majority of ATX /BTX platforms are targeted to function in
an environment that will have up to a 35 °C ambient temperature external to the
system.
For ATX platforms, an active air-cooled design, assumed be used in ATX Chassis, with
a fan installed at the top of the heatsink equivalent to the reference design (see
Chapter 6) should be designed to manage the processor TDP at an inlet temperature
of 35 °C + 5°C = 40 °C.
For BTX platforms, a front-to-back cooling design equivalent to Intel BTX TMA Type II
reference design (see the Chapter 5) should be designed to manage the processor
TDP at an inlet temperature of 35 °C + 0.5 °C = 35.5 °C.
The slope of the thermal profile was established assuming a generational improvement
in thermal solution performance of the Intel reference design. For an example of Intel
Core™2 Duo processor E8000 series with 6 MB in ATX platform, its improvement is
about 15% over the Intel reference design (E18764-001). This performance is
expressed as the slope on the thermal profile and can be thought of as the thermal
resistance of the heatsink attached to the processor, Ψ
intercept on the thermal profile assumes a maximum ambient operating condition that
is consistent with the available chassis solutions.
Thermal and Mechanical Design Guidelines
37.5 mm
37.5 mm
Measure T
Measure T
at this point
at this point
C
C
(geometric center of the package)
(geometric center of the package)
(Refer to Section 3.1). The
CA
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