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User Manuals: Intel 5400 Series CPU Processors
Manuals and User Guides for Intel 5400 Series CPU Processors. We have
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Intel 5400 Series CPU Processors manual available for free PDF download: Design Manuallines
Intel 5400 Series Design Manuallines (100 pages)
Quad-Core Processor Thermal/Mechanical Design Guidelines
Brand:
Intel
| Category:
Computer Hardware
| Size: 3 MB
Table of Contents
Table of Contents
3
Revision History
7
1 Introduction
9
Objective
9
Scope
9
References
9
Reference Documents
9
Definition of Terms
10
Terms and Descriptions
10
2 Thermal/Mechanical Reference Design
13
Mechanical Requirements
13
Processor Mechanical Parameters
13
Processor Mechanical Parameters Table
13
Quad-Core Intel® Xeon® Processor 5400 Series Package
14
Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (1 of 3)
15
Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (2 of 3)
16
Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (3 of 3)
17
Quad-Core Intel® Xeon® Processor 5400 Series Considerations
18
Processor Thermal Parameters and Features
19
Thermal Control Circuit and TDP
19
Processor Case Temperature Measurement Location
19
Digital Thermal Sensor
20
Platform Environmental Control Interface (PECI)
21
Multiple Core Special Considerations
21
DTS Domain for Quad-Core Intel® Xeon® Processor 5400 Series
21
Input and Output Conditions for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Management Features
22
Processor Core Geometric Center Locations
23
Processor Core Geometric Center Dimensions
23
Thermal Profile
24
Thermal Profile Diagram
24
TCONTROL Definition
25
TCONTROL Value and Digital Thermal Sensor Value Interaction
25
Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5400 Series
26
TCONTROL and Thermal Profile Interaction
26
Dual Thermal Profile Diagram
27
Performance Targets
28
Thermal Profile for the Quad-Core Intel® Xeon® Processor X5400 Series
29
Thermal Profile for Quad-Core Intel® Xeon® Processor E5400 Series
30
Thermal Profile for Quad-Core Intel® Xeon® Processor X5482 Series
31
Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5400 Series
31
Fan Fail Guidelines
32
Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor E5400 Series
32
Characterizing Cooling Solution Performance Requirements
33
Fan Speed Control
33
TCONTROL and Fan Speed Control
33
Processor Thermal Characterization Parameter Relationships
34
Processor Thermal Characterization Parameter Relationships
35
Chassis Thermal Design Considerations
36
Thermal/Mechanical Reference Design Considerations
37
Heatsink Solutions
37
Heatsink Design Considerations
37
Thermal Interface Material
38
Summary
38
Assembly Overview of the Intel Reference Thermal Mechanical Design
39
Exploded View of CEK Thermal Solution Components
39
Assembly Drawing
39
Thermal Solution Performance Characteristics
41
CEK Heatsink Thermal Performance
41
Thermal Profile Adherence
42
CEK Heatsink Thermal Performance
42
CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile a
43
CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile B
44
Components Overview
45
CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile
45
Isometric View of the 2U+ CEK Heatsink
46
Isometric View of the 1U CEK Heatsink
46
CEK Heatsink Thermal Mechanical Characteristics
47
Thermal Interface Material (TIM)
47
Recommended Thermal Grease Dispense Weight
47
CEK Spring Isometric View
48
Isometric View of CEK Spring Attachment to the Base Board
48
Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile
49
Boxed Active CEK Heatsink Solutions with PWM/DTS Control (Representation Only)
49
Fan Power Supply
50
Fan Cable Connection (Active CEK)
50
Fan Specifications (Boxed 4-Wire PWM/DTS Heatsink Solution)
50
Fan Cable Connector Pin out (Active CEK)
51
Boxed Processor Contents
51
A-1 Isometric View of the 1U Alternative Heatsink
53
A.1 Component Overview
53
A 1U Alternative Heatsink Thermal/Mechanical Design
53
Component Overview
53
Isometric View of the 1U Alternative Heatsink
53
A-1 1U Alternative Heatsink Thermal Mechanical Characteristics
54
A-2 1U Alternative Heatsink Thermal Performance
54
Thermal Solution Performance Characterics
54
Thermal Profile Adherence
54
Alternative Heatsink Thermal Performance
54
A-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon Processor L5400 Series Thermal Profile
55
Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile
55
B Mechanical Drawings
57
CEK Spring (Sheet 1 of 3)
57
CEK Spring (Sheet 2 of 3)
57
CEK Spring (Sheet 3 of 3)
57
CEK Heatsink (Sheet 2 of 4)
57
CEK Heatsink (Sheet 3 of 4)
57
CEK Heatsink (Sheet 4 of 4)
57
Alternative Heatsink (2 of 4)
57
Alternative Heatsink (3 of 4)
57
Alternative Heatsink (4 of 4)
57
CEK Heatsink (Sheet 1 of 4)
58
CEK Heatsink (Sheet 2 of 4)
59
CEK Heatsink (Sheet 3 of 4)
60
CEK Heatsink (Sheet 4 of 4)
61
B-5 CEK Spring (Sheet 1 of 3)
62
B-6 CEK Spring (Sheet 2 of 3)
63
B-7 CEK Spring (Sheet 3 of 3)
64
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6)
65
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 2 of 6)
66
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 3 of 6)
67
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 4 of 6)
68
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 5 of 6)
69
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 6 of 6)
70
B-14 1U CEK Heatsink (Sheet 1 of 4)
71
B-15 1U CEK Heatsink (Sheet 2 of 4)
72
B-16 1U CEK Heatsink (Sheet 3 of 4)
73
B-17 1U CEK Heatsink (Sheet 4 of 4)
74
Active CEK Thermal Solution Volumetric (Sheet 1 of 3)
75
Active CEK Thermal Solution Volumetric (Sheet 2 of 3)
76
Active CEK Thermal Solution Volumetric (Sheet 3 of 3)
77
B-21 1U Alternative Heatsink (1 of 4)
78
B-22 1U Alternative Heatsink (2 of 4)
79
B-23 1U Alternative Heatsink (3 of 4)
80
B-24 1U Alternative Heatsink (4 of 4)
81
C.1 Overview
83
C Heatsink Clip Load Methodology
83
Overview
83
Test Preparation
83
Heatsink Preparation
83
Load Cell Installation in Machined Heatsink Base Pocket - Bottom View
84
Load Cell Installation in Machined Heatsink Base Pocket - Side View
85
Preload Test Configuration
85
Typical Test Equipment
86
Test Procedure Examples
86
Time-Zero, Room Temperature Preload Measurement
86
Preload Degradation under Bake Conditions
87
Safety Requirements
89
Quality and Reliability Requirements
91
Intel Verification Criteria for the Reference Designs
91
Reference Heatsink Thermal Verification
91
Environmental Reliability Testing
91
Use Conditions Environment
92
Post-Test Pass Criteria
92
Recommended Test Sequence
92
Material and Recycling Requirements
93
Recommended Bios/Processor/Memory Test Procedures
93
F.1 Supplier Information
95
F Enabled Suppliers Information
95
Supplier Information
95
Intel Enabled Suppliers
95
Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel
95
Reference Solution
95
Additional Suppliers
96
F.1.2 Additional Suppliers
96
Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series
97
Intel Reference Solution
97
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