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THERMAL SPECIFICATIONS AND DESIGN CONSIDERATIONS
Table 10-1. Pentium
Processor
Core
L2 Cache
Frequency
Size
(MHz)
(kB)
300
512
266
512
233
512
NOTES:
1.
These values are specified at nominal Vcc
L2 cache.
2.
Processor power is 100% of processor core and 100% L2 cache power.
3.
Thermal plate power is 100% of the processor core power and a percentage of the L2 cache power.
The processor power is a result of heat dissipated through the thermal plate and other paths.
The heat dissipation is a combination of heat from both the processor core and L2 cache. The
overall system thermal design must comprehend the processor power. The combination of the
processor core and the L2 cache dissipating heat through the thermal plate is the thermal
plate power. The heatsink should be designed to dissipate the thermal plate power. See
Table 10-1 for Pentium II processor thermal design specifications.
10.2. PENTIUM
10.2.1. Thermal Solution Performance
All processor thermal solutions should attach to the thermal plate.
The thermal solution must adequately control the thermal plate and cover temperatures below
the maximum and above the minimum specified in Table 10-1. The performance of any
thermal solution is defined as the thermal resistance between the thermal plate and the
ambient air around the processor (Θ
between the thermal plate and the ambient air, the more efficient the thermal solution is. The
required Θ
thermal plate to ambient
temperature (T
), the ambient temperature (T
PLATE
The maximum T
PLATE
of the system design. Table 10-2 provides the resultant thermal solution performance for a
266 MHz Pentium II processor at different ambient air temperatures around the processor.
10-2
®
II Processor Thermal Design Specifications
Max
Max
Thermal
Processor
Plate
Power
(2)
Power
(3)
(W)
(W)
43.0
41.4
38.2
37.0
34.8
33.6
CORE
®
II PROCESSOR THERMAL ANALYSIS
thermal plate to ambient
is dependent upon the maximum allowed thermal plate
Θ
= (T
thermal plate to ambient
and the thermal plate power are listed in Table 10-1. T
Min T
Max T
PLATE
PLATE
(°C)
(°C)
5
72
5
75
5
75
for the processor core and nominal Vcc
). The lower the thermal resistance
) and the thermal plate power (P
LA
– T
) / P
PLATE
LA
PLATE
(1)
Min T
Min T
COVER
COVER
(°C)
(°C)
5
72
5
75
5
75
(3.3V) for the
L2
).
PLATE
is a function
LA
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