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1.2.1.
S.E.C. Cartridge Terminology
The following terms are used often in this document and are explained here for clarification:
•
®
Pentium
II Processor — The entire product including internal components, substrate,
thermal plate and cover.
•
S.E.C. Cartridge — The new processor packaging technology is called a "Single Edge
Contact cartridge."
•
Processor Substrate —The structure on which the components are mounted inside the
S.E.C. cartridge (with or without components attached).
•
Processor Core — The processor's execution engine.
•
Thermal Plate — The surface used to connect a heatsink or other thermal solutions to
the processor.
•
Cover — The processor casing on the opposite side of the thermal plate.
•
Latch Arms — A processor feature that can be utilized as a means for securing the
processor in the retention mechanism.
Additional terms referred to in this and other related documentation:
•
Slot 1 — The connector that the S.E.C. cartridge plugs into, just as the Pentium
processor uses Socket 8.
•
Retention Mechanism — A mechanical piece which holds the package in the Slot 1
connector.
•
Heatsink Support — The support pieces that are mounted on the motherboard to
provide added support for heatsinks.
The L2 cache (TagRAM, BSRAM) dies keep standard industry names.
1.3.
REFERENCES
The reader of this specification should also be familiar with material and concepts presented
in the following documents:
•
AP-485, Intel Processor Identification with the CPUID Instruction (Order Number
241618)
•
®
AP-585, Pentium
•
®
AP-586, Pentium
•
®
AP-587, Pentium
•
AP-588, Mechanical and Assembly Technology for S.E.C. Cartridge Processors (Order
Number 243333)
•
®
AP-589, Pentium
II Processor GTL+ Guidelines (Order Number 243330)
II Processor Thermal Design Guidelines (Order Number 243331)
II Processor Power Distribution Guidelines (Order Number 243332)
II Processor Electro-Magnetic Interference (Order Number 243334)
COMPONENT INTRODUCTION
®
Pro
1-3
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