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Processor Thermal/Mechanical Information—Intel
®
Pentium
Dual-Core E2160 Processor
Figure 2.
Processor Case Temperature Measurement Location
2.2.2
Thermal Profile
The Thermal Profile defines the maximum case temperature as a function of processor
power dissipation. The TDP and Maximum Case Temperature are defined as the
maximum values of the thermal profile. By design, the thermal solutions must meet the
thermal profile for all system operating conditions and processor power levels.
The slope of the thermal profile was established assuming a generational improvement
in thermal solution performance of about 15% over the previous Intel reference design,
less than the Intel RCBFH-3 reference design and about 28% less than the BTX Type II
reference design. Refer to the Intel® Pentium® 4 Processor on 90 nm Process in the
775-Land LGA Package Thermal and Mechanical Design Guidelines, available on
www.intel.com
This performance is expressed as the slope on the thermal profile and can be thought
of as the thermal resistance of the heatsink attached to the processor, Ψ
Section
3.1). The intercept on the thermal profile assumes a maximum ambient
operating condition that is consistent with the available chassis solutions.
To determine compliance to the thermal profile, a measurement of the actual processor
power dissipation is required. The measured power is plotted on the Thermal Profile to
determine the maximum case temperature. Using the example in Figure 3 for a
processor dissipating 70W, the maximum case temperature is 61°C. Refer to the
datasheet for the thermal profile.
October 2007
Order Number: 315279 -003US
®
TM
Core
2 Duo E6400, E4300, and Intel
37.5 mm
37.5 mm
for details on the RCBFH-3 thermal solution.
®
TM
Intel
Core
2 Duo E6400, E4300, and Intel
®
Measure T
Measure T
at this point
at this point
C
C
(geometric center of the package)
(geometric center of the package)
CA
®
®
Pentium
Dual-Core E2160 Processor
(Refer to
TDG
15
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