Related Manuals for Intel FCPGA2 - Processor - 1 x Pentium 4 2.66 GHz
Summary of Contents for Intel FCPGA2 - Processor - 1 x Pentium 4 2.66 GHz
- Page 1 ® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines June 2001 Order Number: 249660-001...
- Page 2 Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right.
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Page 3: Table Of Contents
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines Contents Introduction ..........................7 1.1. Document Scope......................7 1.2. References ........................7 1.3. Definition of Terms ......................8 Importance of Thermal Management................... 9 FC-PGA2 Processor Packaging Technology................11 Thermal Specifications....................... - Page 4 ® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines Conclusion ..........................33 Figures Figure 3-1. FC-PGA2 Mechanical Specifications ..............11 Figure 5-1. Example of Air Exchange Through a µATX PC Chassis ........15 Figure 7-1. Processor-Heatsink Thermal Resistance Relationships ........23 Figure 7-2.
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Page 5: Revision History
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines Revision History Rev. Description Date -001 Initial Release June 2001 249660-001... - Page 6 ® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines This page is intentionally left blank. 249660-001...
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Page 7: Introduction
® ® III processors in the FC- This document discusses thermal management techniques for Intel Pentium PGA2 package with an integrated heat spreader, which is primarily intended for the desktop and server segments. The physical dimensions and power numbers used in this document are for reference only. -
Page 8: Definition Of Terms
III processor in the FC-PGA2 package - any Pentium III processor with CPUID Intel Pentium ® ® 06Bxh, as well as the higher frequencies of Intel Pentium III processors with CPUID 068xh (see ® III Processor for the PGA370 Socket Datasheet for further details). the Pentium... -
Page 9: Importance Of Thermal Management
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines Importance of Thermal Management The objective of thermal management is to ensure that the temperature of all components in a system is maintained within functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet their specified performance requirements. - Page 10 ® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines This page is intentionally left blank. 249660-001...
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Page 11: Fc-Pga2 Processor Packaging Technology
® ® III processor is available in Flip Chip Pin Grid Array 2 (FC-PGA2) packaging. The The Intel Pentium FC-PGA2 package consists of the microprocessor silicon core with integrated L2 cache mounted on a pinned substrate. The silicon core is encased by a heat spreader, which is integrally mounted to the FC- PGA2 substrate. -
Page 12: Table 3-1. Fc-Pga2 Processor Package Dimensions
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines Table 3-1. FC-PGA2 Processor Package Dimensions Symbol Millimeters Inches Minimum Maximum Notes Minimum Maximum Notes 2.266 2.690 0.089 0.106 0.980 1.180 0.038 0.047 30.800 31.200 1.212 1.229 30.800... -
Page 13: Thermal Specifications
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines Thermal Specifications For the purposes of this design guideline, the following assumptions have been made about the requirements for proper operation and reliability of the processor: Considering the power dissipation levels and typical system ambient environments (T... - Page 14 ® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines This page is intentionally left blank. 249660-001...
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Page 15: Designing For Thermal Performance
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines Designing for Thermal Performance 5.1. Airflow Management It is important to manage the volume and velocity of air that flows within the system, as well as how it flows, to maximize the amount of cool air that flows over the processor. -
Page 16: Recommended Fan Performance And Limitations
Intel is enabling reference active and passive heatsinks for FC-PGA2 packaged processors. Please see the FC-PGA2 Package Thermal/Mechanical Solution Functional Specifications for further details. -
Page 17: Bond Line Thickness
The maximum noise levels may differ from country to country. Fan/heatsink assemblies are one type of advanced solution that can be used to cool the processor. Intel has worked with fan/heatsink vendors and computer manufacturers to make fan/heatsink cooling solutions available in the industry. Please consult such a vendor to acquire the proper solution for your needs. -
Page 18: Placement
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines 5.6.1. Placement Proper placement of the fans can ensure that the processor is being properly cooled. Because of the difficulty in building, measuring, and modifying a mechanical assembly for thermal evaluation, models are typically developed and used to simulate a proposed design for thermal effectiveness, and to determine the optimum location for fans and vents within a chassis. -
Page 19: Vent Shape
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines EMI containment area due to EMI constraints. Outside the EMI containment area, the open percentage can be greater if needed for aesthetic appeal (i.e., bezel/cosmetics). 5.6.4.3. Vent Shape Round, staggered pattern openings are best for EMI containment, acoustics, and airflow balance. - Page 20 ® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines This page is intentionally left blank. 249660-001...
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Page 21: Alternative Cooling Solutions
For example, ducted blowers, heat pipes and liquid cooling are all capable of dissipating additional heat. Due to their varying attributes, each of these solutions may be appropriate for a particular system implementation. More information on this topic can be located on Intel's web site at http://developer.intel.com/. - Page 22 ® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines This page is intentionally left blank. 249660-001...
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Page 23: Thermal Metrology For Fc-Pga2 Packaged Processors
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines Thermal Metrology for FC-PGA2 Packaged Processors The following sections will discuss the thermal metrology used on the FC-PGA2 packaged processors. These techniques should be followed to evaluate thermal performance of proposed solutions. Carefully read the following instructions and interpretation steps to validate your cooling solution. -
Page 24: Thermal Solution Performance
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines Equation 2. Case to Ambient Thermal Resistance Where: thermal resistance from case to local-ambient (°C/W) processor case temperature (°C) CASE local-ambient temperature in chassis around processor (°C) processor Thermal Design Power dissipation (W) (assume all power goes to the case) case-to-sink thermal resistance (°C/W) -
Page 25: Local-Ambient Temperature Measurement Guidelines
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines 7.3. Local-ambient Temperature Measurement Guidelines Local-ambient temperature, T , is the temperature of the ambient air surrounding the processor. In a system environment, ambient temperature is the temperature of the air upstream of the processor and in its close vicinity;... -
Page 26: Local-Ambient Temperature Measurement For An Active Heatsink
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines 7.3.2. Local-ambient Temperature Measurement for an Active Heatsink During system thermal testing, a minimum of two thermocouples should be placed approximately 0.5 to 1.0 inches (12.7 to 25.4 mm) above the fan inlet as shown in Figure 7-3. The two thermocouples should be placed 1.0 to 2.0 (25.4 to 50.8 mm) inches apart. -
Page 27: Processor Case Temperature Measurements
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines 7.4.1. Processor Case Temperature Measurements To ensure functionality and reliability, the FC-PGA2 packaged processors are specified for proper operation when T is maintained at or below the value listed in their respective processor datasheets. -
Page 28: Figure 7-4. Locating Geometric Center Of Processor
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines Figure 7-4. Locating Geometric Center of Processor After the marks are scribed, clean the desired thermocouple attach location with a mild solvent and a lint-free wipe or cloth. Alcohol or acetone should suffice. Remember that the cleaner the part is, the stronger the bond will be after curing. -
Page 29: Figure 7-6. Thermocouple Adhesive Placement
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines With the thermocouple in place, the epoxy can now be mixed and applied. Follow the manufacturer's directions for mixing the epoxy. Use a clean, finely pointed applicator to apply the epoxy to the bead. Dab the epoxy bond on the bead and the exposed wires. -
Page 30: Heatsink Preparation
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines 7.4.1.1. Heatsink Preparation In order to measure the case temperature as accurately as possibly, the heatsink must be modified to allow for the thermocouple wires and attach points. Depending on the chosen solution the dimensions may vary. -
Page 31: About The High Power Application
L2 cache utilization. This mode of operation produces a large amount of thermal power from the processor. Contact your Intel Field Sales representative to obtain a copy of the software. 7.4.3. Executing the High Power Application Software The High Power Application software is a 32 bit Windows NT* or Windows* 95/98 application. - Page 32 ® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines Windows 95/98 environment, and not from a DOS only environment. The High Power Application software puts the processor into an infinite loop and locks the command prompt environment. The “HIPWR30.EXE”...
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Page 33: Conclusion
® ® Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines Conclusion As the complexity of today's microprocessors continues to increase, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Heat can be dissipated using passive heatsinks, fans and/or active cooling devices.