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THERMAL SPECIFICATIONS AND DESIGN CONSIDERATIONS
Figure 10-6. Heatsink Attachment Mechanism Design Space
10.3.1. Heatsink Clip Attach
Figure 10-7 and Figure 10-8 illustrate example clip designs to support a low profile and a full
height heatsink, respectively. The clips attach the heatsink by engaging with the underside of
the thermal plate. The clearance of the thermal plate to the internal processor substrate is a
minimum 0.125" (illustrated in Figure 10-7, Figure 10-8 and Figure 10-6). The clips should
be designed such that they will engage within this space, and also not damage the substrate
upon insertion or removal. Finally, the clips should be able to retain the heatsink onto the
thermal plate through a system level mechanical shock and vibration test. The clips should
also apply a high enough force to spread the interface material for the spot size selected.
10-7
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