Boxed Processor Fan/Heatsink Support Dimensions - Intel Pentium II Developer's Manual

Any motherboard components placed in the area beneath the fan/heatsink supports must
recognize the clearance (H) give in Table 12-3 below. Component height restrictions for
passive heatsink support designs, as described in AP-588, Mechanical and Assembly
Technology for S.E.C. Cartridge Processors (Order Number 243333), still apply.
Motherboards designed for use by system integrators should not have objects installed in the
heatsink support holes. Otherwise, removal instructions for objects pre-installed in the
heatsink support holes should be included in the motherboard documentation.
Table 12-2. Boxed Processor Fan/Heatsink Support Dimensions
Fig. Ref. Label
G Fan/Heatsink support height
H Fan/Heatsink support clearance above motherboard
J Fan/Heatsink support standoff diameter
K Fan/Heatsink support front edge to heatsink support hole
center
L Fan/Heatsink support standoff protrusion beneath
motherboard
M Motherboard thickness
N Spacing between fan/heatsink support posts
P Fan/Heatsink support width
Q Fan/Heatsink support inner edge to heatsink support hole
NOTES:
1. This table applies to the dimensions noted in Figure 12-5 through Figure 12-7.
2. All dimensions are in inches. Unless otherwise specified, all x.xxx dimension tolerance is ±0.005 inches.
All x.xx dimension tolerance is ±0.01 inches.
BOXED PROCESSOR SPECIFICATIONS
Dimensions (Inches) Min Typ Max
2.261
0.430
0.275 0.300
0.240
0.06
0.05 0.06 0.075
4.084
0.600
0.400
12-5