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R
®
®
Intel
Pentium
4 Processor on
90 nm Process in the 775–Land
LGA Package
Thermal and Mechanical Design Guidelines
®
®
Supporting Intel
Pentium
4 Processor 5xx and 6xx Sequences in
®
®
the 775-land LGA Package and Intel
Pentium
4 Processor
Extreme Edition in the 775-land LGA Package
November 2005
Document Number:
302553-004
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Table of Contents
Related Manuals for Intel EM64T - Celeron D 336 Boxed Ena
Summary of Contents for Intel EM64T - Celeron D 336 Boxed Ena
- Page 1 Thermal and Mechanical Design Guidelines ® ® Supporting Intel Pentium 4 Processor 5xx and 6xx Sequences in ® ® the 775-land LGA Package and Intel Pentium 4 Processor Extreme Edition in the 775-land LGA Package November 2005 Document Number: 302553-004...
- Page 2 See www.intel.com/info/em64t for more information including details on which processors support Intel EM64T or consult with your system vendor for more information. Intel, Pentium, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
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Page 3: Table Of Contents
Contents Introduction ......................... 9 Document Goals and Scope .................. 9 1.1.1 Importance of Thermal Management ............. 9 1.1.2 Document Goals ..................9 1.1.3 Document Scope .................. 10 References ......................11 Definition of Terms ....................12 Processor Thermal/Mechanical Information ..............15 Mechanical Requirements.................. - Page 4 ............59 CONTROL Appendix A LGA775 Socket Heatsink Loading ..................61 LGA775 Socket Heatsink Considerations ............61 Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel Reference Design....................61 A.2.1 Heatsink Preload Requirement Limitations .......... 61 Thermal/Mechanical Design Guide...
- Page 5 Appendix E Board Level PWM and Fan Speed Control Requirements ..........87 Appendix F Balanced Technology Extended (BTX) System Thermal Considerations ......91 Appendix G Mechanical Drawings......................93 Appendix H Intel Enabled Reference Solution Information ..............105 Thermal/Mechanical Design Guide...
- Page 6 Figure 7. Concept for Clocks under Thermal Monitor Control .......... 33 Figure 8. Random Vibration PSD..................42 Figure 9. Shock Acceleration Curve ................. 43 ® Figure 10. Intel RCBFH-3 Reference Design..............46 ® Figure 11. Intel RCBFH-3 Reference Design (Exploded View) ........47 Figure 12.
- Page 7 Table 7. FSC Definitions ....................87 Table 8. ATX FSC Settings ....................89 Table 9. Balanced Technology Extended (BTX) FSC Settings ........89 Table 10. Intel Representative Contact for Licensing Information........105 Table 11. Intel Reference Component Thermal Solution Provider ......... 105 Thermal/Mechanical Design Guide...
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Page 8: Revision History
• Updated to add information for the Intel -002 Pentium 4 processor 660, February 2005 ® 650, 640, and 630 in the 775-land LGA package and the Intel ® Pentium 4 processor Extreme Edition in the 775-land LGA package ® ®... -
Page 9: Introduction
The goal of this document is to provide an understanding of these thermal characteristics and discuss guidelines for meeting ® ® the thermal requirements imposed on single processor systems for the Intel Pentium 4 processor in the 775–Land LGA package. -
Page 10: Document Scope
Pentium 4 Processor 6xx Sequence and Intel Pentium 4 Processor ® Extreme Edition Datasheet – On 90 nm Process in the 775-land LGA Package, supporting Intel Φ ® Extended Memory 64 Technology , and supporting Intel Virtualization Technology as appropriate. If needed for clarity, the specific processor datasheet will be referenced. -
Page 11: References
Package and Supporting Intel Extended Memory 64 Φ Technology Datasheet LGA775 Socket Mechanical Design Guide http://developer.intel.com/design/Pentium 4/guides/302666.htm Boxed Intel® Pentium® 4 Processor in the 775-Land LGA http://www.intel.com/go/integration Package - Integration Video Fan Specification for 4-wire PWM Controlled Fans http://www.formfactors.org/ Performance ATX Desktop System Thermal Design http://www.formfactors.org/... -
Page 12: Definition Of Terms
Introduction Definition of Terms Term Description The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink. The case temperature of the processor, measured at the geometric center of the topside of the IHS. - Page 13 Introduction Term Description Fan Speed Control: Thermal solution that includes a variable fan speed which is driven by a PWM signal and uses the on-die thermal diode as a reference to change the duty cycle of the PWM signal. Constant from the processor datasheet that is added to the that CONTROL_OFFSET CONTROL_BASE...
- Page 14 Introduction Thermal/Mechanical Design Guide...
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Page 15: Processor Thermal/Mechanical Information
Processor Thermal/Mechanical Information Processor Thermal/Mechanical Information Mechanical Requirements 2.1.1 Processor Package The Pentium 4 processor is packaged in a 775–land LGA package that interfaces with the motherboard via a LGA775 socket. Refer to the processor datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket. - Page 16 Processor Thermal/Mechanical Information The primary function of the IHS is to transfer the non-uniform heat distribution from the die to the top of the IHS, out of which the heat flux is more uniform and spread over a larger surface area (not the entire IHS area).
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Page 17: Heatsink Attach
The attach mechanism for the heatsink developed to support the Pentium 4 processor in the 775–land LGA package should create a static preload on the package between 18 lbf and 70 lbf throughout the life of the product for designs compliant with the Intel reference design assumptions: •... -
Page 18: Additional Guidelines
The amount of power that can be dissipated as heat through the processor package substrate and into the socket is usually minimal. Intel has introduced a new method for specifying the thermal limits for the Pentium 4 Processor in the 775–land LGA package. The new parameters are the Thermal Profile and T . -
Page 19: Thermal Profile
The slope of the thermal profile was established assuming a generational improvement in thermal solution performance of about 10% based on previous Intel reference designs. This performance is expressed as the slope on the thermal profile and can be thought of as the thermal resistance of the heatsink attached to the processor, Ψ... -
Page 20: Tcontrol
This is achieved in part by using the Ψ vs. RPM and RPM vs. Acoustics (dBA) performance curves from the Intel enabled thermal solution. A thermal solution designed to meet the thermal profile should perform virtually the same for any value of T CONTROL... -
Page 21: Heatsink Design Considerations
Processor Thermal/Mechanical Information Heatsink Design Considerations To remove the heat from the processor, three basic parameters should be considered: • The area of the surface on which the heat transfer takes place. Without any enhancements, this is the surface of the processor package IHS. One method used to improve thermal performance is by attaching a heatsink to the IHS. -
Page 22: Heatsink Size
The package IHS flatness for the product is specified in the processor datasheet and can be used as a baseline to predict heatsink performance during the design phase. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to capture any impact of IHS flatness change due to combined socket and heatsink loading. -
Page 23: Thermal Interface Material
System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities The ATX Intel reference thermal solution assumes that the chassis delivers a maximum T 38 °C at the inlet of the processor fan heatsink (refer to Section 5.1.1). 2.4.2 Improving Chassis Thermal Performance The heat generated by components within the chassis must be removed to provide an adequate operating environment for both the processor and other system components. -
Page 24: Summary
• Physical volumetric constraints placed by the system System Integration Considerations ® ® Boxed Intel Pentium 4 Processor in the 775-Land LGA Package - Integration Video provides best known methods for package and heatsink installation and removal for LGA775 socket based platforms and systems manufacturing. -
Page 25: Thermal Metrology
Thermal Metrology Thermal Metrology This chapter discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature to validate a thermal solution. To define the performance of a thermal solution the “thermal characterization parameter”, Ψ... -
Page 26: Example
The following provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any Intel processor thermal specifications, and are for illustrative purposes only. -
Page 27: Processor Thermal Solution Performance Assessment
Thermal performance of a heatsink should be assessed using a thermal test vehicle (TTV) provided by Intel. The TTV is a stable heat source from which the user can take accurate power measurements, whereas actual processors can introduce additional factors that can impact test results. - Page 28 Thermal Metrology should be placed approximately 3 mm to 8 mm [0.1 to 0.3 in] above the fan hub vertically and halfway between the fan hub and the fan housing horizontally as shown in Figure 5 (avoiding the hub spokes). Using an open bench to characterize an active heatsink can be useful, and usually ensures more uniform temperatures at the fan inlet.
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Page 29: Figure 5. Locations For Measuring Local Ambient Temperature, Active Heatsink
Thermal Metrology Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink Note: Drawing Not to Scale Figure 6. Locations for Measuring Local Ambient Temperature, Passive Heatsink Note: Drawing Not to Scale Thermal/Mechanical Design Guide... -
Page 30: Processor Case Temperature Measurement Guidelines
Thermal Metrology Processor Case Temperature Measurement Guidelines The Pentium 4 processor in the 775–land LGA package is specified for proper operation when T is maintained at or below the thermal profile as listed in the datasheet. The measurement location for T is the geometric center of the IHS. -
Page 31: Thermal Management Logic And Thermal Monitor Feature
Fortunately, there are numerous ways to reduce the power consumption of a processor, and Intel is aggressively pursuing low power design techniques. For example, decreasing the operating voltage, reducing unnecessary transistor activity, and using more power efficient circuits can significantly reduce processor power consumption. -
Page 32: Prochot# Signal
Thermal Management Logic and Thermal Monitor Feature 4.2.1 PROCHOT# Signal The Pentium 4 processor in the 775–land LGA package has a bi-directional PROCHOT# capability to allow system designs to protect various components from over-temperature situations. The PROCHOT# signal is bi-directional in that it can either signal when the processor has exceeded its maximum operating temperature or be driven from an external source to activate the TCC. -
Page 33: Operation And Configuration
Thermal Management Logic and Thermal Monitor Feature Figure 7. Concept for Clocks under Thermal Monitor Control PROCHOT# Normal clock Internal clock Duty cycle control Resultant internal clock 4.2.3 Operation and Configuration To maintain compatibility with previous generations of processors, which have no integrated thermal logic, the Thermal Control Circuit portion of Thermal Monitor is disabled by default. -
Page 34: On-Demand Mode
4.2.5 System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for all Pentium 4 processors in the 775–land LGA package based systems. The thermal control circuit is intended to protect against short term thermal excursions that exceed the capability of a properly designed processor thermal solution. -
Page 35: Operating System And Application Software Considerations
Thermal Management Logic and Thermal Monitor Feature For information regarding THERMTRIP#, refer to the processor datasheet and to Section 4.2.8 of this Thermal Design Guidelines. 4.2.6 Operating System and Application Software Considerations The Thermal Monitor feature and its thermal control circuit work seamlessly with ACPI compliant operating systems. -
Page 36: Correction Factors For The On-Die Thermal Diode
Thermal Management Logic and Thermal Monitor Feature 4.2.7.2 Correction Factors for the On-Die Thermal Diode A number of issues can affect the accuracy of the temperature reported by thermal diode sensors. These include the diode ideality and the series resistance that are characteristics of the processor on-die thermal diode. -
Page 37: Thermtrip# Signal
Thermal Management Logic and Thermal Monitor Feature 4.2.8 THERMTRIP# Signal In the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon temperature has reached its operating limit. At this point the system bus signal THERMTRIP# goes active and power must be removed from the processor. - Page 38 Thermal Management Logic and Thermal Monitor Feature Thermal/Mechanical Design Guide...
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Page 39: Intel ® Thermal/Mechanical Reference Design Information
1. The target performance in Table 2 is the Thermal Profile for processors with PRB=1. 2. Solutions to support processors with PRB=0 may be derived from designs supporting the thermal profile for processors with PRB=1. 3. Refer to Section 5.6 for complete description of the Intel ATX reference solution RCBFH-3. Thermal/Mechanical Design Guide... -
Page 40: Acoustics
T specifications CONTROL described in Section 2.2.3. Intel’s recommendation is to use the Fan Specification for 4 Wire PWM Controlled Fans to implement fan speed control capability based on-die thermal diode temperature. Refer to Chapter 6 for further details. -
Page 41: Reference Heatsink Thermal Validation
Intel® Thermal/Mechanical Reference Design Information 5.1.4 Reference Heatsink Thermal Validation The Intel reference heatsink is validated within specific boundary conditions based on the methodology described in Section 5.2. Testing is done on bench top test boards at ambient lab temperature. In particular, for the reference heatsink, the Plexiglas* barrier is installed 81.28 mm [3.2 in] above the motherboard... -
Page 42: Environmental Reliability Testing
Intel® Thermal/Mechanical Reference Design Information Environmental Reliability Testing 5.2.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, board-level vibration and shock tests of a given thermal solution in the assembled state. The thermal solution should meet the specified thermal performance targets after these tests are conducted;... -
Page 43: Recommended Test Sequence
Intel® Thermal/Mechanical Reference Design Information Figure 9. Shock Acceleration Curve Time (m illiseconds) 5.2.1.2.1 Recommended Test Sequence Each test sequence should start with components (i.e., motherboard, heatsink assembly, etc.) that have not been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/Processor/Memory test (refer to Section 5.2.3). -
Page 44: Power Cycling
Intel® Thermal/Mechanical Reference Design Information 5.2.2 Power Cycling Thermal performance degradation due to TIM degradation is evaluated using power cycling testing. The test is defined by 7,500 cycles for the case temperature from room temperature (~23 ºC) to the maximum case temperature defined by the thermal profile at TDP. -
Page 45: Safety Requirements
Intel® Thermal/Mechanical Reference Design Information Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the following safety standards: • UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved. -
Page 46: Atx Reference Thermal Mechanical Solution For The Intel Pentium 4 Processor In The 775-Land Lga Package
0.325 °C/W = 30 °C 2400 RPM 4.5 BA ® Note: RCBFH-3 performance in Table 4 is relative to the Intel Pentium 4 Processor 5xx sequence. Refer to Table 2 for performance of the RCBFH-3 with the other processors. ®... -
Page 47: Figure 11. Intel Rcbfh-3 Reference Design (Exploded View)
Intel® Thermal/Mechanical Reference Design Information A more detailed drawing of the Intel RCBFH-3 Reference Solution is provided in Figure 55, in Appendix G. ® Figure 11. Intel RCBFH-3 Reference Design (Exploded View) Fan Attach Fan Attach Extrusion Extrusion Copper Core... -
Page 48: Reference Attach Mechanism
Intel RCBFH-3 reference design is 191.3 N +/- 44.5 N [43 lb ± 10 lb]. Note: Intel reserves the right to make changes and modifications to the design as necessary to the Intel RCBFH-3 reference design, in particular the clip and fastener. -
Page 49: Mechanical Interface To The Reference Attach Mechanism
• Four plastic fasteners, see Appendix G, Figure 50, Figure 51, Figure 52, and Figure 53 for the component drawings. Figure 10 and Figure 11 show the reference attach mechanism as part of the Intel RCBFH-3 Reference Design. The clip is assembled to heatsink during copper core insertion, and is meant to be trapped between the core shoulder and the extrusion as shown in Figure 13. - Page 50 To minimize the risk of MSDs use of the correct tools and assembly techniques and supporting equipment is recommended. Intel can assist in the selection of a tool for the installation of this heat sink when the risk of MSD needs to be minimized. Contact your Intel field sales representative for assistance.
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Page 51: Figure 14. Critical Parameters For Interfacing To Reference Clip
Intel® Thermal/Mechanical Reference Design Information Figure 14. Critical Parameters for Interfacing to Reference Clip Fin Array Fin Array Core Core See Detail A See Detail A Clip Clip Fin Array Fin Array Fin Array Fin Array Fin Array Fin Array 1.6 mm... - Page 52 Intel® Thermal/Mechanical Reference Design Information Thermal/Mechanical Design Guide...
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Page 53: Acoustic Fan Speed Control
Acoustic Fan Speed Control As processor power has increased, the required thermal solutions have generated increasingly more noise. Intel has added an option to the processor thermal specifications that allows the system integrators to have a quieter system under typical usage. T... -
Page 54: Minimum Fan Speed Set Point
Acoustic Fan Speed Control Chapter 5 discussed in detail the reference thermal solution, including the target Ψ , fan speed and temperatures to ensure that T is not exceeded for TDP power at a given ambient C-MAX temperature. The resulting variable speed fan (VSF) curve is the upper limit on fan speed. The benefit of this upper limit will become more apparent when the fan speed controller is responding to the on-die thermal diode temperatures. -
Page 55: Board And System Implementation
Acoustic Fan Speed Control Board and System Implementation Once the thermal solution is defined, the system designer and board designer can define the fan speed control implementation. The first step is to select the appropriate fan speed controller (FSC). Figure 17 shows the major connections for a typical implementation. Figure 17. -
Page 56: Temperature To Begin Fan Acceleration
Acoustic Fan Speed Control Figure 18. Fan Speed Control Full Speed Full Speed 100 % 100 % Min Speed Min Speed CONTROL CONTROL Diode Temperature Diode Temperature (°C) (°C) 6.3.1.1 Temperature to begin Fan Acceleration The first item to consider is the value for T . -
Page 57: Figure 19. Temperature Range = 5 °C
Acoustic Fan Speed Control Figure 19. Temperature Range = 5 °C Fan RPM Tdiode Tcontrol Tlow 3500 3000 2500 2000 1500 1000 Time (s) An alternate would be to consider a slightly larger value such as T = 10 °C. In this case the RANGE design is trading off the acoustic margin for thermal margin. -
Page 58: Minimum Pwm Duty Cycle
• Acoustic target at system idle • Voltage regulator cooling For a motherboard design intending to use the Intel Boxed Pentium 4 Processor in 775–land LGA Package or the enabled reference thermal solution the recommended minimum PWM duty cycle is 30%. -
Page 59: Combining Thermistor And Thermal Diode Control
The minimum requirement for thermal compliance is to ensure the thermal solution, by design, meets the thermal profile. If the system design will incorporate variable speed fan control, Intel requires monitoring the on- die thermal diode to implement acoustic fan speed control. The value of the on-die thermal diode temperature determines which specification must be met. - Page 60 Acoustic Fan Speed Control Thermal/Mechanical Design Guide...
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Page 61: Appendix Alga775 Socket Heatsink Loading
Mechanical shock and vibration and TIM performance and LGA775 socket protection against fatigue failure. Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel Reference Design A.2.1 Heatsink Preload Requirement Limitations Heatsink preload by itself is not an appropriate metric for solder joint force across various mechanical designs and does not take into account for example (not an exhaustive list): •... -
Page 62: Motherboard Deflection Metric Definition
LGA775 Socket Heatsink Loading Simulation shows that the solder joint force (F ) is proportional to the board deflection axial measured along the socket diagonal. The matching of F required to protect the LGA775 axial socket solder joint in temperature cycling is equivalent to matching a target MB deflection. Therefore, the heatsink preload for LGA775 socket solder joint protection against fatigue failure can be more generally defined as the load required to create a target board downward deflection throughout the life of the product. -
Page 63: Board Deflection Limits
LGA775 Socket Heatsink Loading Figure 22. Board Deflection Definition d’1 d’2 A.2.3 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL – d_ref ≥ 0.09 mm and d_EOL – d_ref ≥ 0.15 mm d’_BOL – d’_ref ≥ 0.09 mm and d_EOL’ – d_ref’ ≥ 0.15 mm NOTES: 1. -
Page 64: Board Deflection Metric Implementation Example
However, there is a small amount of creep accounted for in the plastic fasteners. This situation is somewhat similar to the Intel Reference Design. The impact of the creep to the board deflection is a function of the clip stiffness: •... -
Page 65: Additional Considerations
LGA775 Socket Heatsink Loading A.2.5 Additional Considerations Intel recommends designing to {d_BOL – d_ref = 0.15mm} at BOL when EOL conditions are not known or difficult to assess. The following information is given for illustration purposes only. It is based on the reference keep-out, assuming there is no fixture that changes board stiffness: d_ref is expected to be 0.18 mm on average, and be as high as 0.22 mm. -
Page 66: Heatsink Selection Guidelines
• The Intel RCBFH-3 Reference Design available from licensed suppliers (refer to Appendix H for contact information). Intel is also collaborating with vendors participating in its third party test house program to evaluate third party solutions. Vendor information will be available and updated regularly after product launch at http://developer.intel.com. -
Page 67: Appendix B Heatsink Clip Load Metrology
380 N/mm [2180 lb/in]. In that case, a protrusion of 0.038 mm [0.0015”] will create an extra load of 15 N [3.3 lb]. Figure 26 shows an example using the Intel RCBFH-3 Reference Heatsink designed for the Pentium 4 processor in the 775–land LGA package. -
Page 68: Figure 24. Load Cell Installation In Machined Heatsink Base Pocket (Bottom View)
Heatsink Clip Load Metrology Note: When optimizing the heatsink pocket depth, the variation of the load cell height should also be taken into account to make sure that all load cells protrude equally from the heatsink base. It may be useful to screen the load cells prior to installation to minimize variation. Remarks: Alternate Heatsink Sample Preparation As just mentioned, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. -
Page 69: Figure 25. Load Cell Installation In Machined Heatsink Base Pocket (Side View)
Heatsink Clip Load Metrology Figure 25. Load Cell Installation in Machined Heatsink Base Pocket (Side View) Wax to maintain load cell in position during heatsink installation Height of pocket ~ height of selected load cell Load cell protrusion (Note: to be optimized depending on assembly stiffness) Figure 26. -
Page 70: Typical Test Equipment
Heatsink Clip Load Metrology B.2.2 Typical Test Equipment For the heatsink clip load measurement, use equivalent test equipment to that listed in Table 6. Table 6. Typical Test Equipment Item Description Part Number (Model) Load cell Honeywell-Sensotec* Model 13 subminiature load cells, AL322BL compression only Notes: 1, 5... -
Page 71: Time-Zero, Room Temperature Preload Measurement
2. Install the test vehicle in the socket 3. Assemble the heatsink reworked with the load cells to motherboard as shown for the Intel RCBFH-3 reference heatsink example in Figure 26, and actuate attach mechanism. - Page 72 Heatsink Clip Load Metrology Thermal/Mechanical Design Guide...
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Page 73: Appendix C Thermal Interface Management
Thermal Interface Management Appendix C Thermal Interface Management To optimize a heatsink design, it is important to understand the impact of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area and interface material thermal conductivity should be managed to realize the most effective thermal solution. - Page 74 Thermal Interface Management interface material area also becomes significant; the larger the desired thermal interface material area, the higher the force required to spread the thermal interface material. § Thermal/Mechanical Design Guide...
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Page 75: Appendix D Case Temperature Reference Metrology
Case Temperature Reference Metrology Appendix D Case Temperature Reference Metrology Objective and Scope This appendix defines a reference procedure for attaching a thermocouple to the IHS of a 775- measurement. This procedure takes into account the specific land LGA processor package for T features of the 775-land LGA package and of the LGA775 socket for which it is intended. -
Page 76: Supporting Test Equipment
Case Temperature Reference Metrology Supporting Test Equipment To apply the reference thermocouple attach procedure, it is recommended to use the equipment (or equivalent) provided in the following table. Item Description Part Number Measurement and Output Microscope Olympus Light microscope or equivalent SZ-40 Digital Multi Meter for resistance measurement Not Available... -
Page 77: Thermal Calibration And Controls
1. It is recommended to follow standard safety procedures and wear safety items like glasses for cutting the IHS and gloves for chemical handling. 2. Ask your Intel field sales representative if you would like assistance to groove and/or install a thermocouple according to the reference process. -
Page 78: Figure 27. 775-Land Lga Package Reference Groove Drawing
Case Temperature Reference Metrology Figure 27. 775-Land LGA Package Reference Groove Drawing Thermal/Mechanical Design Guide... -
Page 79: Figure 28. Ihs Reference Groove On The 775-Land Lga Package
Case Temperature Reference Metrology The orientation of the groove relative to the package pin 1 indicator (gold triangle in one corner of the package) is shown in Figure 28 for the 775-land LGA package IHS. Figure 28. IHS Reference Groove on the 775-Land LGA Package IHS Groove Pin1 indicator When the processor is installed in the LGA775 socket, the groove is perpendicular to the socket... -
Page 80: Thermocouple Attach Procedure
Case Temperature Reference Metrology Thermocouple Attach Procedure D.6.1 Thermocouple Conditioning and Preparation 1. Use a calibrated thermocouple as specified in Sections D.3 and D.4. 2. Measure the thermocouple resistance by holding both wires on one probe and the tip of thermocouple to the other probe of the DMM (measurement should be about~75 ohms for 40-gauge type T thermocouple). -
Page 81: Figure 31. Securing Thermocouple Wires With Kapton Tape Prior To Attach
Case Temperature Reference Metrology Figure 31. Securing Thermocouple Wires with Kapton Tape Prior to Attach 7. Lift the wire at the middle of groove with tweezers and bend the front of wire to place the thermocouple in the channel ensuring the tip is in contact with the end of the channel grooved in the IHS (Figure 32-A and B). -
Page 82: Figure 33. Position Bead On The Groove Step
Case Temperature Reference Metrology 8. Place the processor under the microscope unit (similar to the one used in Figure 36) to continue with the process. It is also recommended to use a fixture (like a processor tray or a plate) to help hold the unit in place for the rest of the attach process. 9. -
Page 83: Figure 35. Using 3D Micromanipulator To Secure Bead Location
Case Temperature Reference Metrology Figure 35. Using 3D Micromanipulator to Secure Bead Location 11. Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the IHS surface. This should be the same value as measured during the thermocouple conditioning see Section D.6.1, step 2 and Figure 36. -
Page 84: Curing Process
Case Temperature Reference Metrology Figure 37. Applying the Adhesive on the Thermocouple Bead 13. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.6.1, step 2) and to ensure the bead is still properly contacting the IHS. D.6.3 Curing Process 14. -
Page 85: Figure 39. Removing Excess Adhesive From Ihs
Case Temperature Reference Metrology 18. Use a blade to carefully shave excess adhesive above the IHS surface (Figure 39). Note: Take usual safety precautions when using open blades and performing this operation. Figure 39. Removing Excess Adhesive from IHS 19. Install new Kapton tape to hold the thermocouple wire down and fill the rest of the groove with adhesive (see Figure 40). -
Page 86: Thermocouple Wire Management
Case Temperature Reference Metrology Thermocouple Wire Management When installing the processor into the socket, make sure that the thermocouple wires exit above the load plate as shown in Figure 41. Pinching the thermocouple wires between the load plate and the IHS will likely damage the wires. Note: When thermocouple wires are damaged, the resulting reading maybe incorrect. -
Page 87: Appendix E Board Level Pwm And Fan Speed Control Requirements
Speed Control Requirements To use all of the features in the Intel reference heatsink design or the Boxed Intel Pentium 4 Processor in 775–land LGA package, system integrators should verify the following functionality is present in the board design. Refer to the Fan Specification for 4 wire PWM Controlled Fans and Chapter 5 for complete details on the Intel enabled thermal solution. -
Page 88: Figure 42. Fsc Definitions Example
Board Level PWM and Fan Speed Control Requirements Figure 42. FSC Definitions Example Requirements Classification • Required – an essential part of the design necessary to meet specifications. Should be considered a pass or fail criterion in selection of a board. •... -
Page 89: Table 8. Atx Fsc Settings
2 °C NOTES: 1. A PWM output set to 25 kHz is the design target for the reference and for the Boxed Intel Processor and the reference design. 2. Use the lowest time available in this range for the device selected. - Page 90 Board Level PWM and Fan Speed Control Requirements Note: The fan speed component vendors provide libraries that are used by the BIOS writer to program the component registers with the parameters listed above. Consult the appropriate vendor datasheet for detailed information on programming their component. §...
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Page 91: Appendix F Balanced Technology Extended (Btx) System Thermal Considerations
The thermal sensor location and elevation are reflected in the Flotherm thermal model airflow ® illustrations (see Figure 43 and Figure 44).The Intel Boxed Boards in BTX form factor have implemented a System Monitor thermal sensor. The following thermal sensor or its equivalent can... -
Page 92: Figure 43. System Airflow Illustration With System Monitor Point Area Identified
Balanced Technology Extended (BTX) System Thermal Considerations Figure 43. System Airflow Illustration with System Monitor Point Area Identified Power Supply Graphics Unit Add-In Card Monitor Point Memory Thermal Module OM16791 Figure 44. Thermal Sensor Location Illustration Thermal Sensor MCH Heatsink Thermal/Mechanical Design Guide... -
Page 93: Appendix G Mechanical Drawings
The following table lists the mechanical drawings included in this appendix. These drawings refer to the reference thermal mechanical enabling components for the Pentium 4 processor in the 775– land LGA package. Note: Intel reserves the right to make changes and modifications to the design as necessary. Drawing Description Page Number ATX/µATX Motherboard Keep-out Footprint Definition and... -
Page 94: Figure 45. Atx/Μatx Motherboard Keep-Out Footprint Definition And Height Restrictions
Mechanical Drawings Figure 45. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components – Sheet 1 Thermal/Mechanical Design Guide... -
Page 95: Figure 46. Atx/Μatx Motherboard Keep-Out Footprint Definition And Height Restrictions
Mechanical Drawings Figure 46. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components – Sheet 2 Thermal/Mechanical Design Guide... -
Page 96: Figure 47. Atx/Μatx Motherboard Keep-Out Footprint Definition And Height Restrictions
Mechanical Drawings Figure 47. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components – Sheet 3 Thermal/Mechanical Design Guide... -
Page 97: Figure 48. Reference Clip Drawings - Sheet 1
Mechanical Drawings Figure 48. Reference Clip Drawings – Sheet 1 Thermal/Mechanical Design Guide... -
Page 98: Figure 49. Reference Clip Drawings - Sheet 2
Mechanical Drawings Figure 49. Reference Clip Drawings – Sheet 2 Thermal/Mechanical Design Guide... -
Page 99: Figure 50. Reference Fastener - Sheet 1
Mechanical Drawings Figure 50. Reference Fastener – Sheet 1 Thermal/Mechanical Design Guide... -
Page 100: Figure 51. Reference Fastener - Sheet 2
Mechanical Drawings Figure 51. Reference Fastener – Sheet 2 Thermal/Mechanical Design Guide... -
Page 101: Figure 52. Reference Fastener - Sheet 3
Mechanical Drawings Figure 52. Reference Fastener – Sheet 3 Thermal/Mechanical Design Guide... -
Page 102: Figure 53. Reference Fastener - Sheet 4
Mechanical Drawings Figure 53. Reference Fastener – Sheet 4 Thermal/Mechanical Design Guide... -
Page 103: Figure 54. Clip/Heatsink Assembly
Mechanical Drawings Figure 54. Clip/Heatsink Assembly Thermal/Mechanical Design Guide... -
Page 104: Figure 55. Intel(R) Rcbfh-3 Reference Solution Assembly
Mechanical Drawings Figure 55. Intel(R) RCBFH-3 Reference Solution Assembly Thermal/Mechanical Design Guide... -
Page 105: Appendix H Intel Enabled Reference Solution Information
Schmidt Cap: C33390 Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice.