Thermal Profile; Thermal Solution Design Requirements; Figure 2-2. Processor Case Temperature Measurement Location - Intel BX80571E7400 - Core 2 Duo 2.8 GHz Processor Manuallines

Processor Thermal/Mechanical Information

Figure 2-2. Processor Case Temperature Measurement Location

2.2.2

Thermal Profile

The Thermal Profile defines the maximum case temperature as a function of processor
power dissipation. Refer to the datasheet for the further information.
2.2.3

Thermal Solution Design Requirements

While the thermal profile provides flexibility for ATX /BTX thermal design based on its
intended target thermal environment, thermal solutions that are intended to function
in a multitude of systems and environments need to be designed for the worst-case
thermal environment. The majority of ATX /BTX platforms are targeted to function in
an environment that will have up to a 35° C ambient temperature external to the
system.
For ATX platforms, an active air-cooled design, assumed be used in ATX Chassis, with
a fan installed at the top of the heatsink equivalent to the reference design (see
Chapter 6) should be designed to manage the processor TDP at an inlet temperature
of 35° C + 5°C = 40° C.
For BTX platforms, a front-to-back cooling design equivalent to Intel BTX TMA Type II
reference design (see the Chapter 5) should be designed to manage the processor TDP
at an inlet temperature of 35° C + 0.5° C = 35.5° C.
The slope of the thermal profile was established assuming a generational
improvement in thermal solution performance of the Intel reference design. For an
example of Intel
improvement is about 15% over the Intel reference design (E18764-001). This
performance is expressed as the slope on the thermal profile and can be thought of as
the thermal resistance of the heatsink attached to the processor, Ψ
Section 3.1). The intercept on the thermal profile assumes a maximum ambient
operating condition that is consistent with the available chassis solutions.
Thermal and Mechanical Design Guidelines
37.5 mm 37.5 mm
® ™
Core 2 Duo Processor E8000 series with 6MB in ATX platform, its
Measure T Measure T at this point at this point
C C
(geometric center of the package) (geometric center of the package)
(Refer to
CA
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