Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Manuals

Manuals and User Guides for Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray. We have 1 Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray manual available for free PDF download: Design Manual

Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Design Manual

Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Design Manual (55 pages)

Thermal Design Guide

Brand: Intel | Category: Computer Hardware | Size: 1.23 MB

Table of Contents

Table of Contents
3
Revision History
6
Introduction

7
- Document Goals and Scope
  7
- References
  9
- Definition of Terms
  9
- Referenced Documents
  9
- Terms Used
  9
Processor Thermal/Mechanical Information

11
- Mechanical Requirements
  11
  - Processor Package
    11
- Package IHS Load Areas
  11
  - Heatsink Attach
    12
    
    Heatsink Clip Load Requirement
    13
    
    Additional Guidelines
    13
  - Thermal Requirements
    14
    
    Processor Case Temperature
    14
    
    Thermal Profile
    15
- Processor Case Temperature Measurement Location
  15
  - Control
    16
- Example Thermal Profile
  16
  - Heatsink Design Considerations
    17
    
    Heatsink Size
    17
    
    Heatsink Mass
    18
    
    Package IHS Flatness
    18
    
    Thermal Interface Material
    18
  - System Thermal Solution Considerations
    19
    
    Chassis Thermal Design Capabilities
    19
    
    Improving Chassis Thermal Performance
    19
    
    Summary
    19
  - System Integration Considerations
    20
Thermal Metrology

21
Thermal Management Logic and Thermal Monitor Feature

26
Intel® Reference Thermal Solution

33
Intel® Quiet System Technology (Intel® QST)

38
LGA775 Socket Heatsink Loading

44
Thermal Interface Management

50
- Bond Line Management
  50
- Interface Material Area
  50
- Interface Material Performance
  50
Case Temperature Reference Metrology

51
- Objective and Scope
  51
Mechanical Drawings

53
- PICMG 1.3 Motherboard Keep-Out Footprint Definition and Height Restrictions for Enabling
  53
- PICMG 1.3 Motherboard Keep-Out, Secondary Side
  54
Intel® Enabled Reference Solution Information

55
- Intel Reference Component PICMG 1.3 Thermal Solution Providers
  55

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