Freescale Semiconductor MPC8260 PowerQUICC II Family Reference Manual page 53

Figure
Number
11-63 CS Signal Selection............................................................................................................. 11-75
11-64 BS Signal Selection............................................................................................................. 11-75
11-65 UPM Read Access Data Sampling...................................................................................... 11-78
11-66 Wait Mechanism Timing for Internal and External Synchronous Masters ......................... 11-79
11-67 DRAM Interface Connection to the 60x Bus (64-Bit Port Size) ........................................ 11-81
11-68 Single-Beat Read Access to FPM DRAM .......................................................................... 11-83
11-69 Single-Beat Write Access to FPM DRAM ......................................................................... 11-84
11-70 Burst Read Access to FPM DRAM (No LOOP) ................................................................ 11-85
11-71 Burst Read Access to FPM DRAM (LOOP) ...................................................................... 11-86
11-72 Burst Write Access to FPM DRAM (No LOOP)................................................................ 11-87
11-73 Refresh Cycle (CBR) to FPM DRAM ................................................................................ 11-88
11-74 Exception Cycle .................................................................................................................. 11-89
11-75 FPM DRAM Burst Read Access (Data Sampling on Falling Edge of CLKIN)................. 11-91
11-76 PowerQUICC II/EDO Interface Connection to the 60x Bus .............................................. 11-92
11-77 Single-Beat Read Access to EDO DRAM.......................................................................... 11-94
11-78 Single-Beat Write Access to EDO DRAM ......................................................................... 11-95
11-79 Single-Beat Write Access to EDO DRAM Using REDO to Insert Three Wait States ....... 11-96
11-80 Burst Read Access to EDO DRAM .................................................................................... 11-97
11-81 Burst Write Access to EDO DRAM ................................................................................... 11-98
11-82 Refresh Cycle (CBR) to EDO DRAM................................................................................ 11-99
11-83 Exception Cycle For EDO DRAM ................................................................................... 11-100
11-84 Pipelined Bus Operation and Memory Access in 60x-Compatible Mode ........................ 11-104
11-85 External Master Access (GPCM)...................................................................................... 11-105
11-86 External Master Configuration with SDRAM Device...................................................... 11-106
12-1 L2 Cache in Copy-Back Mode.............................................................................................. 12-2
12-2 External L2 Cache in Write-Through Mode ......................................................................... 12-4
12-3 External L2 Cache in ECC/Parity Mode............................................................................... 12-6
12-4 Read Access with L2 Cache.................................................................................................. 12-8
13-1 Test Logic Block Diagram .................................................................................................... 13-2
13-2 TAP Controller State Machine .............................................................................................. 13-3
13-3 Output Pin Cell (O.Pin)......................................................................................................... 13-4
13-4 Observe-Only Input Pin Cell (I.Obs) .................................................................................... 13-4
13-5 Output Control Cell (IO.CTL) .............................................................................................. 13-5
13-6 General Arrangement of Bidirectional Pin Cells .................................................................. 13-5
14-1 PowerQUICC II CPM Block Diagram ................................................................................. 14-3
14-2 Communications Processor (CP) Block Diagram................................................................. 14-6
14-3 RISC Controller Configuration Register (RCCR................................................................. 14-9
14-4 RISC Time-Stamp Control Register (RTSCR) ................................................................... 14-11
14-5 RISC Time-Stamp Register (RTSR) ................................................................................... 14-12
14-6 CP Command Register (CPCR).......................................................................................... 14-13
14-7 Dual-Port RAM Block Diagram ......................................................................................... 14-18
Freescale Semiconductor
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MPC8260 PowerQUICC II Family Reference Manual, Rev. 2
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