Ip53 Node Boards; Table 3-2 Memory Dimm Specifications - Silicon Graphics Origin 3900 User Manual

3: Cx-brick

IP53 Node Boards

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The Cx-brick consists of one to four IP53 node boards. Each IP53 node board has the
following components:
• 1 Bedrock application-specific integrated circuit (ASIC) that enables communication
between the processors, memory, network, and I/O devices.
• 0 or 4 processors (labeled A, B, C, and D in Figure 3-2).
• 8 MB of L2 cache for each processor to reduce memory latency.
• 2 MegArray connectors (1 XIO and 1 NUMAlink 3) to connect the IP53 node board
to the router board.
• 2, 4, 6, or 8 dual-inline memory modules (DIMMs) that provide from 1 GB to 8 GB of
local memory. The Cx-brick supports 512 MB and 1 GB single DIMM sizes (see
Table 3-2).
Table 3-2 Memory DIMM Specifications
Memory Kit
1 GB with premium integrated directory memory
2 GB with premium integrated directory memory
Your SGI support service engineer (SSE) can increase or decrease the size of
memory by adding or removing DIMM pairs.
DDR SDRAM
Single DIMM Size Technology
512 MB 128 Mbits
1 GB 256 Mbits
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