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v Follow the suggested actions in the order in which they are listed in the Action column until the problem is
solved.
v See Chapter 3, "Parts listing, Type 7998," on page 235 to determine which components are CRUs and which
components are FRUs.
v If an action step is preceded by "(Trained service technician only)," that step must be performed only by a
trained service technician.
Isolation
Symptom
Procedure Code
FSPSP09
A problem has been
detected with a
memory DIMM, but
it cannot be isolated
to a specific memory
DIMM.
FSPSP10
The part indicated in
the CRU callout that
follows this
procedure is invalid
or missing for this
system's
configuration.
FSPSP11
The service processor
has detected an error
on the RIO/HSL port
in the system unit.
FSPSP12
The DIMM CRU that
was called out failed
to correct the
memory error.
Action
Replace the CRU called out after this FSPSP call. If the CRU that is
called out is a DIMM CRU, perform the following procedure:
1. Replace both memory DIMMs of the pair on the microprocessor that
contains the failing CRU:
DIMM 1 (P1-C4)
Replace DIMMS 1 and 2.
DIMM 2 (P1-C3)
Replace DIMMS 1 and 2.
DIMM 3 (P1-C1)
Replace DIMMS 3 and 4.
DIMM 4 (P1-C2)
Replace DIMMS 3 and 4.
2. See "Removing a memory module" on page 251 for location
information and the removal procedure.
3. Install new memory DIMMs, as described in "Installing a memory
module" on page 251.
See "Supported DIMMs" on page 4 for more information.
1. If there is only one CRU called out after this FSPSP10 call:
a. Verify that the CRU is installed, connected, and seated properly.
b. If the CRU is seated properly and the problem persists, replace
the CRU.
c. If the CRU is missing, add the CRU.
2. If multiple CRUs are called out, they have identical serial numbers.
Remove all but one of the CRUs.
1. Verify that the operating system is running. If it is running, perform
an in-band firmware update, as described in "Updating the
firmware" on page 277.
2. If the problem persists, replace the system board and chassis
assembly, as described in "Replacing the Tier 2 system-board and
chassis assembly" on page 274.
Replace the system board and chassis assembly, as described in
"Replacing the Tier 2 system-board and chassis assembly" on page 274.
209
Chapter 2. Diagnostics
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