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Package Information
The 80331 is offered in a Flip Chip Ball Grid Array (FCBGA) package. This is a full-array package
with 829 ball connections. The mechanical dimensions for this package are provided in the figure
below and
(FCBGA), mapped by pin function. This diagram is helpful in placing components around the
80331 for the layout of a PCB. To simplify routing and minimize the number of cross traces, keep
this layout in mind when placing components on your board. The signals, by design, are located on
the FCBGA package to simplify signal routing and system implementation.
Table 2.
Table
2.
Figure 3
and
Figure 4
FC-style, H-PBGA Package Dimensions
Symbol
A
A1
A3
b
C
D
E
F1
F2
e
S1
S2
NOTE: Measurement in millimeters.
Intel® 80331 I/O Processor Design Guide
show the 829 pins of the Flip Chip Ball Grid Array
829-Pin BGA
Minimum
2.392
0.50
0.742
0.61 Ref.
1.15
37.45
37.45
9.88 Ref.
10.16 Ref.
1.27 Ref.
0.97 Ref.
0.97 Ref.
Package Information
2
Maximum
2.942
0.70
0.872
1.37
37.55
37.55
17
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