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Package Mechanical Specifications and Pin Information
4
Package Mechanical
Specifications and Pin
Information
4.1
Package Mechanical Specifications
The processor is available in 4-MB and 2-MB, 478-pin Micro-FCPGA packages as well as
4-MB and 2-MB, 479-ball Micro-FCBGA packages. The package mechanical dimensions,
keep-out zones, processor mass specifications, and package loading specifications are
shown in
The mechanical package pressure specifications are in a direction normal to the surface
of the processor. This requirement is to protect the processor die from fracture risk due
to uneven die pressure distribution under tilt, stack-up tolerances and other similar
conditions. These specifications assume that a mechanical attach is designed
specifically to load one type of processor.
Intel also specifies that 15-lbf load limit should not be exceeded on any of Intel's BGA
packages so as to not impact solder joint reliability after reflow. This load limit ensures
that impact to the package solder joints due to transient bend, shock, or tensile loading
is minimized. The 15-lbf metric should be used in parallel with the 689-kPa (100 psi)
pressure limit as long as neither limits are exceeded.
Moreover, the processor package substrate should not be used as a mechanical
reference or load-bearing surface for the thermal or mechanical solution. Please refer
to the Santa Rosa Platform Mechanical Design Guide for more details.
Caution:
The Micro-FCBGA package incorporates land-side capacitors. The land-side capacitors
are electrically conductive so care should be taken to avoid contacting the capacitors
with other electrically conductive materials on the motherboard. Doing so may short
the capacitors and possibly damage the device or render it inactive.
Note:
For E-step based processors refer the 4-MB and Fused 2-MB package drawings. For M-
step based processors refer to the 2-MB package drawings.
Datasheet
Figure 6
through
Figure
13.
41
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