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12.
Package and Pinout Information
12.1
Package Information
The GD82559ER is a 196-pin Ball Grid Array (BGA) package. Package dimensions are shown in
Figure
24. More information on Intel device packaging is available in the Intel Packaging
Handbook, which is available from the Intel Literature Center or your local Intel sales office.
Datasheet
Figure 24. Dimension Diagram for the GD82559ER 196-Pin BGA
Networking Silicon — GD82559ER
85
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