Package Mechanical Specifications And Pin Information; Micro-Fcpga Package Top And Bottom Isometric Views - Intel RH80536GC0332M - Pentium M 1.8 GHz Processor Datasheet

4
Package Mechanical
Specifications and Pin Information
The Pentium M Processor is available in 478-pin, Micro-FCPGA and 479-ball, Micro-FCBGA
packages. Different views of the Micro-FCPGA package are shown in
Figure 4-3. Package dimensions are shown in
package are shown in
The Micro-FCBGA package may have capacitors placed in the area surrounding the die. Because
the die-side capacitors are electrically conductive, and only slightly shorter than the die height, care
should be taken to avoid contacting the capacitors with electrically conductive materials. Doing so
may short the capacitors, and possibly damage the device or render it inactive. The use of an
insulating material between the capacitors and any thermal solution should be considered to
prevent capacitor shorting.
Figure 4-1. Micro-FCPGA Package Top and Bottom Isometric Views
LABEL
TOP VIEW
NOTE: All dimensions in millimeters. Values shown for reference only. Refer to
Datasheet

Package Mechanical Specifications and Pin Information

Table
Figure 4-4 through Figure
DIE
Figure 4-1
4-1. Different views of the Micro-FCBGA
4-6. Package dimensions are shown in
PACKAGE KEEPOUT
CAPACITOR AREA
BOTTOM VIEW
Table 4-1
through
Table 4-2.
for details.
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