Package Mechanical Specifications And Pin Information; Package Mechanical Specifications - Intel P8700 - Core 2 Duo Processor Datasheet

Package Mechanical Specifications and Pin Information

4 Package Mechanical
Specifications and Pin
Information
4.1

Package Mechanical Specifications

The processor (XE and SV) is available in 478-pin Micro-FCPGA packages as well as
479-ball Micro-FCBGA packages. The package mechanical dimensions are shown in
Figure 9
The processor (POP, LV, ULV DC and ULV SC) is available 956-ball Micro-FCBGA
packages. The package mechanical dimensions are shown in
The maximum outgoing co-planarity is 0.2 mm (8 mils) for SFF processors.
The mechanical package pressure specifications are in a direction normal to the surface
of the processor. This protects the processor die from fracture risk due to uneven die
pressure distribution under tilt, stack-up tolerances and other similar conditions. These
specifications assume that a mechanical attach is designed specifically to load one type
of processor.
A 15-lbf load limit should not be exceeded on BGA packages so as to not impact solder
joint reliability after reflow. This load limit ensures that impact to the package solder
joints due to transient bend, shock, or tensile loading is minimized. The 15-lbf metric
should be used in parallel with the 689-kPa (100 psi) pressure limit as long as neither
limits are exceeded. In some cases, designing to 15 lbf will exceed the pressure
specification of 689 kPa (100 psi) and therefore should be reduced to ensure both limits
are maintained.
Moreover, the processor package substrate should not be used as a mechanical
reference or load-bearing surface for the thermal or mechanical solution.
Caution: The Micro-FCBGA package incorporates land-side capacitors. The land-side capacitors
are electrically conductive so care should be taken to avoid contacting the capacitors
with other electrically conductive materials on the motherboard. Doing so may short
the capacitors and possibly damage the device or render it inactive.
Datasheet
through Figure 13.
Figure 14 and Figure 15.
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