DDC Total-AceXtreme MIL-STD-1553 Design Manual page 20

Table 1. Total-AceXtreme® Series Specifications
PARAMETER
1553 MESSAGE TIMING
BC Intermessage Gap (Note 7)
BC/RT/MT No-Response Timeout – mid-parity-to-mid-sync
programmable range (Note 8)
RT Response Time (mid-parity to mid-sync)
Transmitter Watchdog Timeout
THERMAL
TOTAL-ACEXTREME BGA 324-BALL BGA PACKAGE
(See Thermal Management Section)
Active Transceiver
• Junction Temperature (T
• Junction-to-Ambient (θJA via simulation)
- Per JESD 51-2 standard at 25°C
θ
in Still Air
JA
THERMAL (Con't)
- Per JESD 51-6 standard at 25°C
θ
@ 1M/S
JA
θ
@ 2M/S
JA
θ
@ 3M/S
JA
• Junction-to-case (θ via simulation)
JC
- Per JESD 51-12 standard at 25°C
θ
JC
• Junction-to-board (θ via simulation)
JB
- Per JESD 51-8
θ
JB
ALL PACKAGES
Operating Case Temperature
- EXX
- 1XX (Note 11)
Operating Junction Temperature
- Transceiver
- Protocol
Storage Temperature
SOLDERING
324-BALL BGA PACKAGE
The reflow profile detailed in IPC/JEDEC J-STD-020 is applicable for both the leaded and lead-free versions of Total-
AceXtreme.
Data Device Corporation
www.ddc-web.com
)
J
MIN TYP
10
4
4 —
— 660.5
— 68.8
— 52.9
— 47.1
— 43.6
— 24.5
— 46.9
-40 —
-55 —
-55 —
-55 —
-65 —
11
O V E R V I E W
MAX UNITS
µs
511.5 µs
7 µs
— µs
150 °C
— °C/W
— °C/W
— °C/W
— °C/W
— °C/W
— °C/W
+100 °C
+125 °C
+150 °C
+135 °C
+150 °C
DS-BU-67301B-G
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