Ordering Information - DDC Total-AceXtreme MIL-STD-1553 Design Manual

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ORDERING INFORMATION

BU-67301B0T0X–X02
Notes:
1. Temperature Range applies to case temperature.
2. See Section 9 for thermal management requirements at high transmit duty cycles.
3. Unless otherwise specified, these products contain tin lead solder.
BU-67301E0T0R–
Data Device Corporation
www.ddc-web.com
– Total-AceXtreme Component
E = -40°C to +100°C (note 1)
1 = -55°C to +125°C (notes 1, 2)
L = Contains Lead
R = RoHS Compliant
JL0 – Hardware / Software Development Kit (Optional)
- PCI Evaluation Board with Cable
- Thermal Model, IBIS Model and Schematic
Symbols
- PCI Card Reference Design Schematic
- JTAG/BSDL File
- CAD Drawing footprints for PADS and Allegro
- MTBF Report, BC Validation Report and RT
Validation
Report
- BusTrACEr® with Application Code Generation for
Software Development
- Drivers for Windows®, Linux®, and VxWorks®
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