Boxed Processor Specifications; Introduction; Boxed Processor Fan Heatsink - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

Lga1156 socket thermal/mechanical specifications and design guidelines
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Boxed Processor Specifications

10
Boxed Processor Specifications
10.1

Introduction

The processor will also be offered as an Intel boxed processor. Intel boxed processors
are intended for system integrators who build systems from baseboards and standard
components. The boxed processor will be supplied with a cooling solution. This chapter
documents baseboard and system requirements for the cooling solution that will be
supplied with the boxed processor. This chapter is particularly important for OEMs that
manufacture baseboards for system integrators.
Note:
Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets].
processor.
Note:
The cooling solution that is supplied with the boxed processor will be halogen free
compliant.
Note:
Drawings in this chapter reflect only the specifications on the Intel boxed processor
product. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designers' responsibility to consider their proprietary
cooling solution when designing to the required keep-out zone on their system
platforms and chassis.
Figure 10-1. Boxed Processor Fan Heatsink
Note:
The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
Thermal/Mechanical Specifications and Design Guidelines
Figure 10-1
shows a mechanical representation of a boxed
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