Sign In
Upload
Manuals
Brands
Intel Manuals
Computer Hardware
X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor
Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Manuals
Manuals and User Guides for Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor. We have
3
Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor manuals available for free PDF download: Datasheet, Design Manual, Specification
Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Datasheet (104 pages)
Data Sheet
Brand:
Intel
| Category:
Computer Hardware
| Size: 2 MB
Table of Contents
Table of Contents
3
1 Introduction
11
Core™2 Quad Processor Q9000 Series)
11
Terminology
12
Processor Terminology Definitions
12
References
14
2 Electrical Specifications
15
Power and Ground Lands
15
Decoupling Guidelines
15
VCC Decoupling
15
Vtt Decoupling
15
FSB Decoupling
16
Voltage Identification
16
Voltage Identification Definition
17
Reserved, Unused, and TESTHI Signals
18
Power Segment Identifier (PSID)
18
Voltage and Current Specification
19
Absolute Maximum and Minimum Ratings
19
DC Voltage and Current Specification
20
Voltage and Current Specifications
21
VCC Static and Transient Tolerance
24
VCC
24
VCC Overshoot
25
Die Voltage Validation
25
Signaling Specifications
26
FSB Signal Groups
26
Signal Characteristics
27
Signal Reference Voltages
27
CMOS and Open Drain Signals
28
Processor DC Specifications
28
GTL+ Signal Group DC Specifications
28
Open Drain and TAP Output Signal Group DC Specifications
28
Platform Environment Control Interface (PECI) DC Specifications
29
CMOS Signal Group DC Specifications
29
GTL+ Front Side Bus Specifications
30
PECI DC Electrical Limits
30
GTL+ Bus Resistance Definitions
30
Clock Specifications
31
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
31
Core Frequency to FSB Multiplier Configuration
31
FSB Frequency Select Signals (BSEL[2:0])
32
Phase Lock Loop (PLL) and Filter
32
BCLK[1:0] Specifications
32
BSEL[2:0] Frequency Table for BCLK[1:0]
32
Front Side Bus Differential BCLK Specifications
32
FSB Differential Clock Specifications (1600 Mhz FSB)
33
FSB Differential Clock Specifications (1333 Mhz FSB)
33
Differential Clock Waveform
34
Measurement Points for Differential Clock Waveforms
34
3 Package Mechanical Specifications
35
Package Mechanical Drawing
35
Processor Package Assembly Sketch
35
Processor Package Drawing (Sheet 1 of 3)
36
Processor Package Drawing (Sheet 2 of 3)
37
Processor Package Drawing (Sheet 3 of 3)
38
Processor Component Keep-Out Zones
39
Package Loading Specifications
39
Package Handling Guidelines
39
Processor Loading Specifications
39
Package Insertion Specifications
40
Processor Mass Specification
40
Processor Materials
40
Processor Markings
40
Processor Top-Side Markings Example
40
Processor Land Coordinates and Quadrants, Top View
42
4 Land Listing and Signal Descriptions
43
Processor Land Assignments
43
Land-Out Diagram (Top View - Left Side)
44
Land Listing and Signal Descriptions
44
Land-Out Diagram (Top View - Right Side)
45
Alphabetical Land Assignments
47
VCC
48
Numerical Land Assignment
59
Alphabetical Signals Reference
64
Signal Description
64
5 Thermal Specifications and Design Considerations
75
Processor Thermal Specifications
75
Thermal Specifications
75
Processor Thermal Specifications
76
Core™2 Extreme Processor QX9770 Thermal Profile
77
Intel Core™2 Extreme Processor QX9650 Thermal Profile
78
Core™2 Quad Processor Q9000 and Q8000 Series Thermal Profile
79
Core™2 Quad Processor Q9000S and Q8000S Series Thermal Profile
80
Thermal Metrology
81
Processor Thermal Features
81
Thermal Monitor
81
Thermal Monitor 2
81
On-Demand Mode
83
Thermal Monitor 2 Frequency and Voltage Ordering
83
PROCHOT# Signal
84
THERMTRIP# Signal
84
Platform Environment Control Interface (PECI)
85
Introduction
85
TCONTROL and TCC Activation on PECI-Based Systems
85
Conceptual Fan Control Diagram on PECI-Based Platforms
85
PECI Specifications
86
PECI Command Support
86
PECI Device Address
86
PECI Fault Handling Requirements
86
PECI Gettemp0() Error Code Support
86
Gettemp0() Error Codes
86
6 Features
87
Power-On Configuration Options
87
Clock Control and Low Power States
87
Power-On Configuration Option Signals
87
Normal State
88
HALT and Extended HALT Powerdown States
88
HALT Powerdown State
88
Processor Low Power State Machine
88
Extended HALT Powerdown State
89
Stop Grant and Extended Stop Grant States
89
Stop-Grant State
89
Extended HALT Snoop State, Extended Stop Grant Snoop State
90
Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State
90
Extended Stop Grant State
90
HALT Snoop State, Stop Grant Snoop State
90
Sleep State
90
Deep Sleep State
91
Deeper Sleep State
91
Enhanced Intel Speedstep ® Technology
92
Processor Power Status Indicator (PSI) Signal
92
7 Boxed Processor Specifications
93
Introduction
93
Mechanical Representation of the Boxed Processor
93
Mechanical Specifications
94
Boxed Processor Cooling Solution Dimensions
94
Space Requirements for the Boxed Processor (Side View)
94
Space Requirements for the Boxed Processor (Top View)
94
Boxed Processor Fan Heatsink Weight
95
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
95
Electrical Requirements
95
Fan Heatsink Power Supply
95
Space Requirements for the Boxed Processor (Overall View)
95
Boxed Processor Fan Heatsink Power Cable Connector Description
96
Baseboard Power Header Placement Relative to Processor Socket
96
Fan Heatsink Power and Signal Specifications
96
Thermal Specifications
97
Boxed Processor Cooling Requirements
97
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View)
97
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)
97
Variable Speed Fan
98
Boxed Processor Fan Heatsink Set Points
98
Fan Heatsink Power and Signal Specifications
98
Boxed Intel
99
Core™2 Extreme Processor QX9650
99
Specifications
99
Boxed Intel ® Core™2 Extreme Processor QX9650 Fan Heatsink Weight
100
Space Requirements for the Boxed Processor (Side View)
100
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View)
100
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)
101
8 Debug Tools Specifications
103
Logic Analyzer Interface (LAI)
103
Mechanical Considerations
103
Electrical Considerations
103
Advertisement
Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual (93 pages)
Xeon Processor C5500/C3500 Series and LGA1366 Socket hermal/Mechanical Design Guide
Brand:
Intel
| Category:
Computer Hardware
| Size: 2 MB
Table of Contents
Table of Contents
3
Revision History
7
1 Introduction
8
Intel ® Xeon ® Processor C5500/C3500 Series Socket Stack-Up
8
Back Plate
8
Definition of Terms
9
Reference Documents
9
Terms and Descriptions
9
2 Package Mechanical Specifications
11
Processor Package Assembly Sketch
11
Package Mechanical Drawing
12
Processor Package Drawing (Sheet 1 of 2)
13
Processor Package Drawing (Sheet 2 of 2)
14
Processor Component Keep-Out Zones
15
Package Loading Specifications
15
Package Handling Guidelines
15
Package Insertion Specifications
15
Processor Loading Specifications
15
Processor Mass Specification
16
Processor Materials
16
Processor Markings
16
Processor Top-Side Markings
16
Processor Land Coordinates
17
Processor Land Coordinates and Quadrants, Bottom View
17
3 LGA1366 Socket
18
LGA1366 Socket with Pick and Place Cover Removed
18
LGA1366 Socket Contact Numbering (Top View of Socket)
19
Board Layout
20
LGA1366 Socket Land Pattern (Top View of Board)
20
Attachment to Motherboard
21
Socket Components
21
Socket Body Housing
21
Solder Balls
21
Contacts
22
Pick and Place Cover
22
Package Installation / Removal
23
Socket Standoffs and Package Seating Plane
23
Package Installation / Removal Features
23
Durability
24
Markings
24
Component Insertion Forces
24
Socket Size
24
LGA1366 Socket NCTF Solder Joints
24
LGA1366 NCTF Solder Joints
25
4 Independent Loading Mechanism (ILM)
26
Design Concept
26
ILM Cover Assembly Design Overview
26
ILM Back Plate Design Overview
27
ILM Cover Assembly
27
Assembly of ILM to a Motherboard
28
Back Plate
28
ILM Assembly
29
Pin1 and ILM Lever
30
5 LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications
31
Component Mass
31
Package/Socket Stackup Height
31
Socket Maximum Temperature
31
Socket Component Mass
31
1366-Land Package and LGA1366 Socket Stackup Height
31
Socket Temperature Measurement Location
32
Loading Specifications
33
Board Deflection Guidance
33
Socket and ILM Mechanical Specifications
33
Electrical Requirements
34
Electrical Requirements for LGA1366 Socket
34
Environmental Requirements
35
Flow Chart of Knowledge-Based Reliability Evaluation Methodology
35
6 Thermal Specifications
36
Package Thermal Specifications
36
Intel Xeon Processor EC5549 and EC5509 Thermal Profile
37
Processor EC5549 and EC5509 Thermal Specifications
37
Processor EC5549 and EC5509 Thermal Profile
38
Processor EC3539 and EC5539 Thermal Specifications
38
Processor EC3539 and EC5539 Thermal Profile
39
Processor LC5528 Thermal Profile
40
Processor LC5528 Thermal Specifications
40
Processor LC5528 Thermal Profile
41
Processor LC5518 Thermal Specifications
41
Processor LC5518 Thermal Profile
42
Processor P1053 Thermal Specifications
43
Processor P1053 Thermal Profile
43
Processor LC3528 Thermal Profile
44
Xeon Processor LC3518 Thermal Profile
44
Processor LC3528 Thermal Specifications
44
Processor LC3528 Thermal Profile
45
Processor LC3518 Thermal Specifications
45
Thermal Metrology
47
TTV Case Temperature (TCASE) Measurement Location
47
Processor Thermal Features
48
Processor Temperature
48
Adaptive Thermal Monitor
48
Frequency and Voltage Ordering
49
THERMTRIP# Signal
51
Platform Environment Control Interface (PECI)
51
Introduction
51
PECI Specifications
53
Gettemp0() Error Codes
53
7 Thermal Solutions
54
Performance Targets
54
Boundary Conditions and Performance Targets
54
1U Heatsink Performance Curves
55
Heat Pipe Considerations
56
ATCA Heatsink Performance Curves
56
Assembly
57
TTV die Size and Orientation
57
1U Reference Heatsink Assembly
57
Thermal Interface Material (TIM)
58
Structural Considerations
58
Thermal Design
59
Thermal Characterization Parameter
59
Processor Thermal Characterization Parameter Relationships
59
NEBS Thermal Profile
60
Power Thermal Utility
61
Thermal Features
61
Fan Speed Control
61
Fan Speed Control, TCONTROL and DTS Relationship
61
PECI Averaging and Catastrophic Thermal Management
62
Intel ® Turbo Boost Technology
62
TCONTROL Guidance
62
Absolute Processor Temperature
63
Custom Heat Sinks for up ATCA
63
UP ATCA Thermal Solution
64
UP ATCA System Layout
64
UP ATCA Heat Sink Drawing
65
8 Quality and Reliability Requirements
66
Use Conditions
66
Server Use Conditions Environment (System Level)
66
Intel Reference Component Validation
67
Board Functional Test Sequence
67
Server Use Conditions Environment (System Level)
67
Post-Test Pass Criteria
68
Recommended Bios/Processor/Memory Test Procedures
68
Material and Recycling Requirements
68
A Component Suppliers
70
Heatsinks and Thermal Interface Material
70
LGA1366 Socket and ILM Components
71
B Mechanical Drawings
72
Mechanical Drawing List
72
Board Keepin / Keepout Zones (Sheet 1 of 4)
73
Board Keepin / Keepout Zones (Sheet 2 of 4)
74
Board Keepin / Keepout Zones (Sheet 3 of 4)
75
Board Keepin / Keepout Zones (Sheet 4 of 4)
76
Reference Heatsink Assembly (Sheet 1 of 2)
77
Reference Heatsink Assembly (Sheet 2 of 2)
78
Reference Heatsink Fin and Base (Sheet 1 of 2)
79
Reference Heatsink Fin and Base (Sheet 2 of 2)
80
Heatsink Shoulder Screw (1U, 2U, and Tower)
81
Heatsink Compression Spring (1U, 2U, and Tower)
82
Heatsink Retaining Ring (1U, 2U, and Tower)
83
Heatsink Load Cup (1U, 2U, and Tower)
84
ATCA Reference Heatsink Assembly (Sheet 1 of 2)
85
ATCA Reference Heatsink Assembly (Sheet 2 of 2)
86
ATCA Reference Heatsink Fin and Base (Sheet 1 of 2)
87
ATCA Reference Heatsink Fin and Base (Sheet 2 of 2)
88
C Socket Mechanical Drawings
89
Mechanical Drawing List
89
Socket Mechanical Drawing - (Sheet 1 of 4)
90
Socket Mechanical Drawing - (Sheet 2 of 4)
91
Socket Mechanical Drawing - (Sheet 3 of 4)
92
Socket Mechanical Drawing - (Sheet 4 of 4)
93
Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Specification (42 pages)
Xeon Processor 3300 Series Specification Update, on 45 nm Process in the 775-land LGA Package
Brand:
Intel
| Category:
Computer Hardware
| Size: 0 MB
Table of Contents
Table of Contents
3
Revision History
5
Preface
6
Summary Tables of Changes
8
Identification Information
14
Component Identification Information
15
Errata
17
Specification Changes
40
Specification Clarifications
41
Documentation Changes
42
Advertisement
Advertisement
Related Products
Intel E5345 - Xeon 2.33 GHz 8M L2 Cache 1333MHz FSB LGA771 Active Quad-Core Processor
Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray
Intel E5420 - CPU XEON QUAD CORE 2.50GHZ FSB1333MHZ 12M LGA771 HALOGEN FREE TRAY
Intel FCPGA2 - Processor - 1 x Pentium 4 2.66 GHz
Intel L5310 - Cpu Xeon Quad-Core Lv 1.6Ghz Fsb1066Mhz 8M Fc-Lga6 Tray
Intel X5472 - Cpu Xeon Quad Core 3.00Ghz Fsb1600Mhz 12M Lga771 Tray
Intel FW82801HB
Intel F-Tile SDI II Intel Agilex
Intel L5335 - Xeon 2.0 GHz 8M L2 Cache 1333MHz FSB LGA771 50W Active Quad-Core Age Processor
Intel FSB533/PC2100
Intel Categories
Motherboard
Computer Hardware
Server
Desktop
Server Board
More Intel Manuals
Login
Sign In
OR
Sign in with Facebook
Sign in with Google
Upload manual
Upload from disk
Upload from URL