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BX80605X3440 - Quad Core Xeon X3440
Intel BX80605X3440 - Quad Core Xeon X3440 Manuals
Manuals and User Guides for Intel BX80605X3440 - Quad Core Xeon X3440. We have
3
Intel BX80605X3440 - Quad Core Xeon X3440 manuals available for free PDF download: Reference, Datasheet, Specification
Intel BX80605X3440 - Quad Core Xeon X3440 Datasheet (98 pages)
Data Sheet
Brand:
Intel
| Category:
Computer Hardware
| Size: 0.51 MB
Table of Contents
Table of Contents
3
Revision History
7
1 Introduction
9
Intel Xeon Processor 3400 Series Platform Diagram
10
Processor Feature Details
11
Supported Technologies
11
Interfaces
11
System Memory Support
11
Intel ® Xeon ® Processor 3400 Series Supported Memory Summary
11
PCI Express
12
Direct Media Interface (DMI)
13
Platform Environment Control Interface (PECI)
14
Power Management Support
14
Processor Core
14
System
14
Memory Controller
14
PCI Express
14
Thermal Management Support
15
Package
15
Terminology
15
Related Documents
17
2 Interfaces
19
System Memory Interface
19
System Memory Technology Supported
19
Supported DIMM Module Configurations
20
System Memory Timing Support
21
System Memory Organization Modes
21
Single-Channel Mode
21
DDR3 System Memory Timing Support
21
Dual-Channel Mode-Intel ® Flex Memory Technology Mode
22
Intel Flex Memory Technology Operation
22
Rules for Populating Memory Slots
23
Dual-Channel Symmetric (Interleaved) and Dual-Channel Asymmetric Modes
23
Fma)
24
Just-In-Time Command Scheduling
24
Command Overlap
24
Out-Of-Order Scheduling
24
System Memory Pre-Charge Power down Support Details
24
System Memory Pre-Charge Power down Support
24
PCI Express* Interface
25
PCI Express* Architecture
25
PCI Express* Layering Diagram
25
Transaction Layer
26
Data Link Layer
26
Physical Layer
26
Packet Flow through the Layers
26
PCI Express* Configuration Mechanism
27
PCI Express* Related Register Structures in Processor
27
PCI Express* Ports and Bifurcation
28
PCI Express* Bifurcated Mode
28
Direct Media Interface (DMI)
28
DMI Error Flow
28
Processor/Pch Compatibility Assumptions
28
DMI Link down
28
Platform Environment Control Interface (PECI)
29
Interface Clocking
29
Internal Clocking Requirements
29
Processor Reference Clock Requirements
29
3 Technologies
31
Intel Virtualization Technology
31
Intel VT-X Objectives
31
Intel VT-X Features
31
Intel VT-D Objectives
32
Intel VT-D Features
32
Intel Trusted Execution Technology (Intel TXT)
33
Intel VT-D Features Not Supported
33
Intel Hyper-Threading Technology
34
Intel Turbo Boost Technology
34
4 Power Management
35
ACPI States Supported
35
System States
35
Processor Core/Package Idle States
35
Integrated Memory Controller States
35
Processor Core/Package State Support
35
PCI Express* Link States
36
Interface State Combinations
36
Processor Core Power Management
36
G, S, and C State Combinations
36
Enhanced Intel ® Speedstep ® Technology
37
Low-Power Idle States
37
Idle Power Management Breakdown of the Processor Cores
37
Thread and Core C-State Entry and Exit
38
Coordination of Thread Power States at the Core Level
38
Requesting Low-Power Idle States
39
Core C-States
39
P_Lvlx to MWAIT Conversion
39
Core C0 State
40
Core C1/C1E State
40
Core C3 State
40
Core C6 State
40
C-State Auto-Demotion
40
Package C-States
41
Coordination of Core Power States at the Package Level
41
Package C0
42
Package C1/C1E
42
Package C-State Entry and Exit
42
Package C3 State
43
Package C6 State
43
IMC Power Management
43
Disabling Unused System Memory Outputs
43
DRAM Power Management and Initialization
44
Initialization Role of CKE
44
Conditional Self-Refresh
44
Dynamic Power down Operation
44
Targeted Memory State Conditions
44
DRAM I/O Power Management
45
PCI Express* Power Management
45
5 Thermal Management
47
6 Signal Description
49
Signal Description Buffer Types
49
System Memory Interface
50
Memory Channel a
50
Memory Channel B
51
Memory Reference and Compensation
52
Reset and Miscellaneous Signals
52
PCI Express* Based Interface Signals
53
DMI-Processor to PCH Serial Interface
53
PLL Signals
54
Intel ® Flexible Display Interface Signals
54
Intel ® Flexible Display Interface
54
JTAG/ITP Signals
55
Jtag/Itp
55
Error and Thermal Protection
56
Power Sequencing
57
Processor Core Power Signals
57
Graphics and Memory Core Power Signals
59
Graphics and Memory Power Signals
59
Ground and NCTF
60
Processor Internal Pull Up/Pull down
60
7 Electrical Specifications
61
Power and Ground Lands
61
Decoupling Guidelines
61
Voltage Rail Decoupling
61
Processor Clocking (BCLK[0], BCLK#[0])
62
PLL Power Supply
62
VCC Voltage Identification (VID)
62
VRD 11.1/11.0 Voltage Identification Definition
63
Market Segment Selection Truth Table for MSID[2:0]
65
Reserved or Unused Signals
66
Signal Groups
66
Signal Groups 1
67
Test Access Port (TAP) Connection
69
Absolute Maximum and Minimum Ratings
69
Processor Absolute Minimum and Maximum Ratings
69
DC Specifications
70
Voltage and Current Specifications
70
Processor Core Active and Idle Mode DC Voltage and Current Specifications
70
Processor Uncore I/O Buffer Supply DC Voltage and Current Specifications
71
Static and Transient Tolerance
72
VCC Static and Transient Tolerance Loadlines
73
DDR3 Signal Group DC Specifications
74
Control Sideband and TAP Signal Group DC Specifications
75
PCI Express* DC Specifications
76
Platform Environmental Control Interface (PECI) DC Specifications
77
DC Characteristics
77
PECI DC Electrical Limits
77
Input Device Hysteresis
78
8 Processor Land and Signal Information
79
Processor Land Assignments
79
Xeon Processor 3400 Series
79
Socket Pinmap (Top View, Upper-Left Quadrant)
80
Socket Pinmap (Top View, Upper-Right Quadrant)
81
Socket Pinmap (Top View, Lower-Left Quadrant)
82
Socket Pinmap (Top View, Lower-Right Quadrant)
83
Processor Pin List by Pin Name
84
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Intel BX80605X3440 - Quad Core Xeon X3440 Reference (106 pages)
LGA1156 Socket Thermal/Mechanical Specifications and Design Guidelines
Brand:
Intel
| Category:
Computer Hardware
| Size: 3.58 MB
Table of Contents
Table of Contents
3
1 Introduction
7
References
7
Reference Documents
7
Definition of Terms
8
Terms and Descriptions
8
2 Package Mechanical and Storage Specifications
11
Package Mechanical Specifications
11
Processor Package Assembly Sketch
11
Package View
12
Processor Loading Specifications
13
Package Handling Guidelines
13
Processor Top-Side Markings
14
Processor Materials
14
Processor Package Lands Coordinates
15
Processor Land Coordinates
15
Processor Storage Specifications
16
Storage Conditions
16
3 LGA1156 Socket
17
LGA1156 Socket with Pick and Place Cover
17
LGA1156 Socket Contact Numbering (Top View of Socket)
18
Board Layout
19
LGA1156 Socket Land Pattern (Top View of Board)
19
LGA1156 Socket NCTF Solder Joints
20
Attachment to Motherboard
21
Socket Components
21
Solder Balls
22
Pick and Place Cover
22
Package Installation / Removal
23
Pick and Place Cover
23
Durability
24
Package Installation / Removal Features
24
Markings
25
Component Insertion Forces
25
Socket Size
25
4 Independent Loading Mechanism (ILM)
27
Design Concept
27
ILM Cover Assembly
28
Back Plate
28
Shoulder Screw
29
Assembly of ILM to a Motherboard
30
ILM Assembly
30
ILM Interchangeability
31
Pin 1 and ILM Lever
31
Markings
32
5 LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications
33
Component Mass
33
Package/Socket Stackup Height
33
Socket Maximum Temperature
33
Socket Component Mass
33
1156-Land Package and LGA1156 Socket Stackup Height
33
Loading Specifications
34
Socket & ILM Mechanical Specifications
34
Electrical Requirements
35
Electrical Requirements for LGA1156 Socket
35
Environmental Requirements
36
Flow Chart of Knowledge-Based Reliability Evaluation Methodology
36
6 Thermal Specifications
37
Thermal Test Vehicle Thermal Profile for Intel Xeon Processor 3400 Series (95W)
39
Ttv Thermal Profile
39
Thermal Test Vehicle Thermal Profile for Intel
40
Thermal Test Vehicle Thermal Profile for Intel Xeon Processor 3400 Series (45W)
41
Processor 3400 Series (45W)
41
Processor Thermal Features
44
TTV Case Temperature (TCASE) Measurement Location
44
Frequency and Voltage Ordering
46
Platform Environment Control Interface (PECI)
48
Temperature Sensor Data Format
49
Supported PECI Command Functions and Codes
49
Error Codes and Descriptions
50
7 Sensor Based Thermal Specification Design Guidance
51
Sensor Based Specification Overview
51
Sensor Based Thermal Specification
52
Comparison of Case Temperature Versus Sensor Based Specification
52
Intel ® Xeon ® Processor 3400 Series (95W) Thermal Profile
53
Thermal Solution Design Process
54
Required YCA for Various TAMBIENT Conditions
55
Boundary Condition Definition
55
Fan Speed Control (FSC) Design Process
56
System Validation
58
8 Collaboration Thermal Solution
59
Performance Targets
59
Boundary Conditions and Performance Targets
59
Heatsink Performance Curves
60
Heatsink Performance Curves
61
Processor 3400 Series (95W)
61
Comparison between TTV Thermal Profile and Thermal Solution Performance
61
Thermal Solution
62
Processor 3400 Series (95W)
62
Assembly
63
Collaboration Heatsink Assembly
63
Geometric Envelope for 1U Thermal Mechanical Design
64
Thermal Interface Material
64
KOZ 3-D Model (Top) in 1U Server
64
9 Thermal Solution Quality and Reliability Requirements
65
Collaboration Heatsink Thermal Verification
65
Mechanical Environmental Testing
65
Collaboration Heatsink
65
Use Conditions (Board Level)
65
Recommended Test Sequence
66
Material and Recycling Requirements
67
10 Boxed Processor Specifications
69
Introduction
69
Boxed Processor Fan Heatsink
69
Mechanical Specifications
70
Space Requirements for the Boxed Processor (Side View)
70
Space Requirements for the Boxed Processor (Top View)
71
Space Requirements for the Boxed Processor (Overall View)
71
Electrical Requirements
72
Boxed Processor Fan Heatsink Power Cable Connector Description
72
Thermal Specifications
73
Baseboard Power Header Placement Relative to Processor Socket
73
Fan Heatsink Power and Signal Specifications
73
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View)
74
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View)
74
Boxed Processor Fan Heatsink Set Points
75
Fan Heatsink Set Points
75
A Component Suppliers
77
Collaboration Heatsink Enabled Components
77
LGA1156 Socket and ILM Components
77
Supplier Contact Information
77
B Mechanical Drawings
79
Collaboration Heatsink Assembly
79
Collaboration Heatsink Screw
79
ILM Shoulder Screw
79
ILM Standard 6-32 Thread Fastener
79
Mechanical Drawing List
79
Socket / Heatsink / ILM Keepout Zone Primary Side for 1U(Top)
80
Socket / Heatsink / ILM Keepout Zone Secondary Side for 1U(Bottom)
81
Socket / Processor / ILM Keepout Zone Primary Side for 1U(Top)
82
Socket / Processor / ILM Keepout Zone Secondary Side for 1U(Bottom)
83
B-5 1U Collaboration Heatsink Assembly
84
B-6 1U Collaboration Heatsink
85
B-7 1U Collaboration Heatsink Screw
86
Heatsink Compression Spring
87
Heatsink Load Cup
88
Heatsink Retaining Ring
89
Heatsink Backplate Assembly
90
Heatsink Backplate
91
Heatsink Backplate Insulator
92
Heatsink Backplate Stud
93
Thermocouple Attach Drawing
94
B-16 1U ILM Shoulder Screw
95
B-17 1U ILM Standard 6-32 Thread Fastener
96
C Socket Mechanical Drawings
97
Mechanical Drawing List
97
Socket Mechanical Drawing (Sheet 1 of 4)
98
Socket Mechanical Drawing (Sheet 2 of 4)
99
Socket Mechanical Drawing (Sheet 3 of 4)
100
Socket Mechanical Drawing (Sheet 4 of 4)
101
D Package Mechanical Drawings
103
Mechanical Drawing List
103
Processor Package Drawing (Sheet 1 of 2)
104
Processor Package Drawing (Sheet 2 of 2)
105
Intel BX80605X3440 - Quad Core Xeon X3440 Specification (63 pages)
Specification Update
Brand:
Intel
| Category:
Computer Hardware
| Size: 0.51 MB
Table of Contents
Table of Contents
3
Revision History
5
Related Documents
6
Preface
6
Summary Tables of Changes
8
Errata
15
Specification Changes
15
Specification Clarifications
15
Identification Information
16
Errata
19
Specification Changes
55
Specification Clarifications
56
Documentation Changes
57
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