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Xeon 5500 Series
Intel Xeon 5500 Series Manuals
Manuals and User Guides for Intel Xeon 5500 Series. We have
2
Intel Xeon 5500 Series manuals available for free PDF download: Design Manual, Specification Update
Intel Xeon 5500 Series Design Manual (98 pages)
Brand:
Intel
| Category:
Computer Hardware
| Size: 4.35 MB
Table of Contents
Table of Contents
3
Revision History
7
1 Introduction
9
Intel® Xeon® 5500 Platform Socket Stack
9
References
10
Definition of Terms
10
Reference Documents
10
Terms and Descriptions
10
2 LGA1366 Socket
13
LGA1366 Socket with Pick and Place Cover Removed
13
LGA1366 Socket Contact Numbering (Top View of Socket)
14
Board Layout
15
LGA1366 Socket Land Pattern (Top View of Board)
15
Attachment to Motherboard
16
Socket Components
16
Socket Body Housing
16
Solder Balls
16
Contacts
17
Pick and Place Cover
17
Package Installation / Removal
18
Socket Standoffs and Package Seating Plane
18
Package Installation / Removal Features
18
Durability
19
Markings
19
Component Insertion Forces
19
Socket Size
19
LGA1366 Socket NCTF Solder Joints
20
LGA1366 NCTF Solder Joints
20
3 Independent Loading Mechanism (ILM)
21
Design Concept
21
ILM Cover Assembly Design Overview
21
ILM Back Plate Design Overview
22
ILM Cover Assembly
22
Assembly of ILM to a Motherboard
23
Back Plate
23
ILM Assembly
24
Pin1 and ILM Lever
25
4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
27
Component Mass
27
Package/Socket Stackup Height
27
Socket Maximum Temperature
27
Socket Component Mass
27
1366-Land Package and LGA1366 Socket Stackup Height
27
Loading Specifications
28
Electrical Requirements
28
Socket and ILM Mechanical Specifications
28
Environmental Requirements
29
Electrical Requirements for LGA1366 Socket
29
Flow Chart of Knowledge-Based Reliability Evaluation Methodology
30
5 Thermal Solutions
31
Performance Targets
31
Boundary Conditions and Performance Targets
31
Heatsink Performance Curves
32
25.5 MM Tall Heatsink
33
Performance Expectations for 25.5 MM Tall Heatsink
33
Heat Pipe Considerations
34
TTV die Size and Orientation
34
Assembly
35
Reference Heatsink Assembly
35
Thermal Interface Material (TIM)
36
Structural Considerations
36
Thermal Design
36
Thermal Characterization Parameter
36
Dual Thermal Profile
37
Processor Thermal Characterization Parameter Relationships
37
Thermal Features
38
Dual Thermal Profile
38
Fan Speed Control
39
CONTROL Guidance
39
T Guidance
39
Intel® Turbo Boost Technology
40
PECI Averaging and Catastrophic Thermal Management
40
Thermal Guidance
40
Thermal Excursion Power for 95 W Processor
40
Thermal Excursion Power for 80 W Processor
41
Absolute Processor Temperature
41
6 Quality and Reliability Requirements
43
Test Conditions
43
Intel Reference Component Validation
45
Board Functional Test Sequence
45
Post-Test Pass Criteria
45
Example Thermal Cycle - Actual Profile will Vary
45
Recommended Bios/Processor/Memory Test Procedures
46
Material and Recycling Requirements
46
A Component Suppliers
47
Intel Enabled Supplier Information
47
Intel Reference Thermal Solution
47
Intel Collaboration Thermal Solution
47
Suppliers for the Intel Reference Thermal Solution
47
Alternative Thermal Solution
48
Suppliers for the Intel Collaboration Thermal Solution
48
Suppliers for the Alternative Thermal Solution
48
Socket and ILM Components
49
LGA1366 Socket and ILM Components
49
Mechanical Drawings
51
Reference Heatsink Fin and Base (Sheet 2 of 2)
51
Mechanical Drawing List
51
Board Keepin / Keepout Zones (Sheet 1 of 4)
52
Board Keepin / Keepout Zones (Sheet 2 of 4)
53
Board Keepin / Keepout Zones (Sheet 3 of 4)
54
Board Keepin / Keepout Zones (Sheet 4 of 4)
55
Reference Heatsink Assembly (Sheet 1 of 2)
56
Reference Heatsink Assembly (Sheet 2 of 2)
57
B-7 1U Reference Heatsink Fin and Base (Sheet 1 of 2)
58
B-8 1U Reference Heatsink Fin and Base (Sheet 2 of 2)
59
Heatsink Shoulder Screw (1U, 2U and Tower)
60
B-10Heatsink Compression Spring (1U, 2U and Tower)
61
B-11Heatsink Retaining Ring (1U, 2U and Tower)
62
B-12Heatsink Load Cup (1U, 2U and Tower)
63
B-132U Collaborative Heatsink Assembly (Sheet 1 of 2)
64
B-142U Collaborative Heatsink Assembly (Sheet 2 of 2)
65
B-152U Collaborative Heatsink Volumetric (Sheet 1 of 2)
66
B-162U Collaborative Heatsink Volumetric (Sheet 2 of 2)
67
B-17Tower Collaborative Heatsink Assembly (Sheet 1 of 2)
68
B-18Tower Collaborative Heatsink Assembly (Sheet 2 of 2)
69
B-19Tower Collaborative Heatsink Volumetric (Sheet 1 of 2)
70
B-20Tower Collaborative Heatsink Volumetric (Sheet 2 of 2)
71
B-211U Reference Heatsink Assembly with TIM (Sheet 1 of 2)
72
B-221U Reference Heatsink Assembly with TIM (Sheet 2 of 2)
73
B-232U Reference Heatsink Assembly with TIM (Sheet 1 of 2)
74
B-242U Reference Heatsink Assembly with TIM (Sheet 2 of 2)
75
B-25Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2)
76
B-26Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2)
77
C Socket Mechanical Drawings
79
Mechanical Drawing List
79
Socket Mechanical Drawing (Sheet 1 of 4)
80
Socket Mechanical Drawing (Sheet 2 of 4)
81
Socket Mechanical Drawing (Sheet 3 of 4)
82
Socket Mechanical Drawing (Sheet 4 of 4)
83
D Heatsink Load Metrology
85
Intel® Xeon® Processor 5500 Series Load Cell Fixture
86
E Embedded Thermal Solutions
87
Performance Targets
87
E.1 Performance Targets
87
Boundary Conditions and Performance Targets
87
Thermal Design Guidelines
88
NEBS Thermal Profile
88
ATCA Heatsink Performance Curves
88
Custom Heat Sinks for up ATCA
89
NEBS Thermal Profile
89
E-3 up ATCA Thermal Solution
90
Mechanical Drawings and Supplier Information
92
E-2 Embedded Heatsink Component Suppliers
92
Mechanical Drawings List
92
ATCA Reference Heat Sink Assembly (Sheet 1 of 2)
93
ATCA Reference Heat Sink Assembly (Sheet 2 of 2)
94
ATCA Reference Heatsink Fin and Base (Sheet 1 of 2)
95
ATCA Reference Heatsink Fin and Base (Sheet 2 of 2)
96
F Processor Installation Tool
97
Processor Installation Tool
98
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Intel Xeon 5500 Series Specification Update (70 pages)
Brand:
Intel
| Category:
Computer Hardware
| Size: 0.42 MB
Table of Contents
Table of Contents
3
Revision History
5
Related Documents
6
Preface
6
Summary Tables of Changes
8
Identification Information
17
Errata
21
Power States
35
Branch Instructions
62
Specification Changes
67
Specification Clarifications
68
Documentation Changes
69
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