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Processor Thermal/Mechanical Information
Intel recommends testing and validating heatsink performance in full mechanical enabling
configuration to capture any impact of IHS flatness change due to combined socket and heatsink
loading. While socket loading alone may increase the IHS warpage, the heatsink preload
redistributes the load on the package and improves the resulting IHS flatness in the enabled state.
2.3.4
Thermal Interface Material
Thermal interface material application between the processor IHS and the heatsink base is
generally required to improve thermal conduction from the IHS to the heatsink. Many thermal
interface materials can be pre-applied to the heatsink base prior to shipment from the heatsink
supplier and allow direct heatsink attach, without the need for a separate thermal interface material
dispense or attach process in the final assembly factory.
All thermal interface materials should be sized and positioned on the heatsink base in a way that
ensures the entire processor IHS area is covered. It is important to compensate for heatsink-to-
processor attach positional alignment when selecting the proper thermal interface material size.
When pre-applied material is used, it is recommended to have a protective cover over it. This cover
must be removed prior to heatsink installation.
2.3.5
Summary
In summary, considerations in heatsink design include:
•
The local ambient temperature T
and the corresponding maximum T
performance parameter, Ψ
information on the definition and the use of Ψ
•
Heatsink interface (to IHS) surface characteristics, including flatness and roughness.
•
The performance of the thermal interface material used between the heatsink and the IHS.
•
The required heatsink clip static load, between 18 lbf to 70 lbf throughout the life of the
product (Refer to
information).
•
Surface area of the heatsink.
•
Heatsink material and technology.
•
Volumetric airflow rate over the heatsink surface area.
•
Development of airflow entering and within the heatsink area.
•
Physical volumetric constraints placed by the system.
2.4
System Thermal Solution Considerations
2.4.1
Improving Chassis Thermal Performance
The heat generated by components within the chassis must be removed to provide an adequate
operating environment for both the processor and other system components. Moving air through
the chassis brings in air from the external ambient environment and transports the heat generated
by the processor and other system components out of the system. The number, size and relative
position of fans and vents determine the chassis thermal performance, and the resulting ambient
temperature around the processor. The size and type (passive or active) of the thermal solution and
Intel
16
(case to air thermal characterization parameter). More
CA
Section 2.1.2.2, "Heatsink Clip Load Requirement" on page 11
®
®
Celeron
D Processor in the 775-Land LGA Package Thermal Design Guide
at the heatsink, the power being dissipated by the processor,
A
. These parameters are usually combined in a cooling
C
is given in
CA
Section 2.4
below.
for further
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