Exploded View Of Cek Thermal Solution Components - Intel 5100 Series Instruction Manual

Dual-core intel xeon processor

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2.4.4.2

Assembly Drawing

Figure 2-14. Exploded View of CEK Thermal Solution Components

The CEK reference thermal solution is designed to extend air-cooling capability through

the use of larger heatsinks with minimal airflow blockage and bypass. CEK retention

solution can allow the use of much heavier heatsink masses compared to the legacy

limits by using a load path directly attached to the chassis pan. The CEK spring on the

secondary side of the baseboard provides the necessary compressive load for the

thermal interface material. The baseboard is intended to be isolated such that the

dynamic loads from the heatsink are transferred to the chassis pan via the stiff screws

and standoffs. This reduces the risk of package pullout and solder-joint failures.

The baseboard mounting holes for the CEK solution are at the same location as the hole

locations used for previous Intel

assembly requires 10.16 mm [0.400 in.] large diameter holes to compensate for the

CEK spring embosses.

The CEK solution is designed and optimized for a baseboard thickness range of 1.57 –

2.31 mm [0.062-0.093 in]. While the same CEK spring can be used for this board

thickness range, the heatsink standoff height is different for a 1.57 mm [0.062 in] thick

board than it is for a 2.31 mm [0.093 in] thick board. In the heatsink assembly, the

standoff protrusion from the base of the heatsink needs to be 0.6 mm [0.024 in] longer

for a 2.31 mm [0.093 in] thick board, compared to a 1.57 mm [0.062 in] thick board.

Xeon

processor thermal solution. However, CEK

Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide

Thermal/Mechanical Reference Design

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