Socket Maximum Temperature; Psi Curves For The Reference Thermal Solution (Mean+3 Sigma) - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Thermal Specifications and Design Guidelines
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Figure 6-3.

Psi Curves for the Reference Thermal Solution (Mean+3 Sigma)

Psi-cc = 0.1031+0.8235*cfm
Psi-cm = 0.0277+0.8159*cfm
Psi-cf = 0.0294+1.0777*cfm
6.1.3

Socket Maximum Temperature

The power dissipated within the socket is a function of the current at the pin level and
the effective pin resistance. To ensure socket long term reliability, Intel defines socket
maximum temperature using a via on the underside of the main board. Exceeding the
temperature guidance may result in socket body deformation, or increases in thermal
and electrical resistance which can cause a thermal runaway and eventual electrical
failure. The guidance for socket maximum temperature is listed below:
• Via temperature under socket must be <95 °C.
• The specific via used for temperature measurement is located on the bottom of the
motherboard between pins BN6 and BJ6.
• The socket maximum temperature is defined at Thermal Design Current (TDC). In
addition, the heatsink performance targets and boundary conditions must be met
to limit power and thermal dissipation through the socket.
To measure via temperature:
• Drill a hole through the back plate corresponding to the location of pins BN6 and
BJ6.
• Thread a T-type thermocouple (36 - 40 gauge) through the hole and glue it into the
specific measurement via on the underside of the motherboard.
• Once the glue dries, reinstall the back plate and measure the temperature.
Order Number: 334785-002
-0.6752 Psi-mm = 0.0603+0.8778*cfm
Psi-mc = 0.0349+0.9174*cfm
-0.6806
-0.7596 Psi-mf = 0.0674+0.8705*cfm
® ®
Intel Xeon
-0.6724
-0.7015
-0.6375
Phi™ Processor x200 Product Family TMSDG
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