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5100 Series
Intel 5100 Series Manuals
Manuals and User Guides for Intel 5100 Series. We have
2
Intel 5100 Series manuals available for free PDF download: Instruction Manual, Design Manual
Intel 5100 Series Instruction Manual (88 pages)
Dual-Core Intel Xeon Processor
Brand:
Intel
| Category:
Computer Hardware
| Size: 2.25 MB
Table of Contents
Table of Contents
3
Revision History
6
1 Introduction
7
Objective
7
Scope
7
References
7
Reference Documents
7
Definition of Terms
8
Terms and Descriptions
8
2 Thermal/Mechanical Reference Design
11
Mechanical Requirements
11
Processor Mechanical Parameters
11
Dual-Core Intel Xeon Processor 5100 Series Processor Package
11
Processor Mechanical Parameters Table
11
Dual-Core Intel® Xeon® Processor 5100 Series Mechanical Drawing
13
Dual-Core Intel Xeon Processor 5100 Series Considerations
14
Processor Thermal Parameters and Features
15
Thermal Control Circuit and TDP
15
Digital Thermal Sensor
16
Platform Environmental Control Interface (PECI)
16
Multiple Core Special Considerations
17
DTS Domain for Dual-Core Intel Xeon Processor 5100 Series
17
Fan Speed Control for Dual-Core Intel Xeon Processor 5100 Series
18
Input and Output Conditions for the Dual-Core Intel Xeon Processor 5100 Series Thermal Management Features
19
Thermal Profile
20
Processor Core Geometric Center Locations
20
Processor Core Geometric Center Dimensions
20
Thermal Profile Diagram
21
TCONTROL Definition
22
TCONTROL Value and Digital Thermal Sensor Value Interaction
22
Thermal Profile Concepts for the Dual-Core Intel Xeon Processor 5100 Series
23
TCONTROL and Thermal Profile Interaction
23
Dual Thermal Profile Diagram
24
Performance Targets
25
Thermal Profile for the Dual-Core Intel Xeon Processor 5148
25
Thermal Profile for the Dual-Core Intel® Xeon® Processor 5110/5120/5130/5140/5150
26
Thermal Profiles a and B for the Dual-Core Intel® Xeon® Processor 5160
27
Intel Reference Heatsink Performance Targets for the Dual-Core Intel® Xeon® Processor 5148
27
Intel Reference Heatsink Performance Targets for the Dual-Core Intel Xeon Processor 5110/5120/5130/5140/5150
28
Characterizing Cooling Solution Performance Requirements
29
Fan Speed Control
29
Intel Reference Heatsink Performance Targets for the Dual-Core Intel Xeon Processor 5160
29
TCONTROL and Fan Speed Control
30
Processor Thermal Characterization Parameter Relationships
31
Processor Thermal Characterization Parameter Relationships
32
Chassis Thermal Design Considerations
33
Thermal/Mechanical Reference Design Considerations
33
Heatsink Solutions
33
Thermal Interface Material
34
Summary
35
Assembly Overview of the Intel Reference Thermal Mechanical Design
35
Exploded View of CEK Thermal Solution Components
36
Thermal Solution Performance Characteristics
37
CEK Heatsink Thermal Performance
38
Thermal Profile Adherence
39
CEK Heatsink Thermal Performance
39
CEK Thermal Adherence to Dual-Core Intel Xeon Processor 5148 Thermal Profile
40
CEK Thermal Adherence to Dual-Core Intel® Xeon® Processor 5110/5120/5130/5140/5150 Thermal Profile
41
CEK Thermal Adherence to Dual-Core Intel Xeon Processor 5160 Thermal Profile a
42
Components Overview
43
CEK Thermal Adherence to Dual-Core Intel Xeon Processor 5160 Thermal Profile B
43
Isometric View of the 2U+ CEK Heatsink
43
Isometric View of the 1U CEK Heatsink
44
CEK Heatsink Thermal Mechanical Characteristics
44
Recommended Thermal Grease Dispense Weight
45
Boxed Active Thermal Solution for the Dual-Core Intel Xeon Processor 5100 Series
46
CEK Spring Isometric View
46
Isometric View of CEK Spring Attachment to the Base Board
46
Boxed Active CEK Heatsink Solutions with PWM/DTS Control (Representation Only)47 2-26 Fan Cable Connection (Active CEK)
48
Fan Cable Connector Pin out (Active CEK)
48
Fan Specifications (Boxed 4-Wire PWM/DTS Heatsink Solution)
48
Boxed Processor Contents
49
A Mechanical Drawings
51
CEK Heatsink (Sheet 2 of 4)
51
CEK Heatsink (Sheet 3 of 4)
51
CEK Heatsink (Sheet 4Of 4)
51
Mechanical Drawing List
51
CEK Heatsink (Sheet 1 of 4)
52
CEK Heatsink (Sheet 2 of 4)
53
CEK Heatsink (Sheet 3 of 4)
54
CEK Heatsink (Sheet 4 of 4)
55
CEK Spring (Sheet 1 of 3)
56
CEK Spring (Sheet 2 of 3)
57
CEK Spring (Sheet 3 of 3)
58
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6)
59
Baseboard Keepout Footprint Definition and
59
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 2 of 6)
60
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 3 of 6)
61
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 4 of 6)
62
A-13 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 6 of 6)
64
A-14 1U CEK Heatsink (Sheet 1 of 4)
65
A-15 1U CEK Heatsink (Sheet 2 of 4)
66
A-16 1U CEK Heatsink (Sheet 3 of 4)
67
A-17 1U CEK Heatsink (Sheet 4Of 4)
68
Active CEK Thermal Solution Volumetric (Sheet 1 of 3)
69
Active CEK Thermal Solution Volumetric (Sheet 2 of 3)
70
Active CEK Thermal Solution Volumetric (Sheet 3 of 3)
71
B Heatsink Clip Load Methodology
73
Overview
73
Test Preparation
73
Heatsink Preparation
73
B-1 Load Cell Installation in Machined Heatsink Base Pocket -- Bottom View
74
Preload Test Configuration
75
B-2 Load Cell Installation in Machined Heatsink Base Pocket -- Side View
75
Test Procedure Examples
76
Time-Zero, Room Temperature Preload Measurement
76
Typical Test Equipment
76
Preload Degradation under Bake Conditions
77
C Safety Requirements
79
D Quality and Reliability Requirements
81
Intel Verification Criteria for the Reference Designs
81
Reference Heatsink Thermal Verification
81
Environmental Reliability Testing
81
Use Conditions Environment
82
Material and Recycling Requirements
83
E Enabled Suppliers Information
85
Supplier Information
85
Intel Enabled Suppliers
85
Suppliers for the Dual-Core Intel Xeon Processor 5100 Series
85
Additional Enabled Suppliers
86
Suppliers of Alternative Thermal Solutions for the Dual-Core Intel Xeon Processor 5100 Series
86
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Intel 5100 Series Design Manual (40 pages)
Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
Brand:
Intel
| Category:
Computer Hardware
| Size: 2.07 MB
Table of Contents
Table of Contents
3
Revision History
5
Introduction
6
Design Flow
6
Definition of Terms
7
Thermal Design Process
7
Related Documents
8
Thermal Simulation
9
Packaging Technology
9
MCH Package Dimensions (Top View)
10
MCH Package Dimensions (Side View)
10
Package Mechanical Requirements
11
MCH Package Dimensions (Bottom View)
11
Thermal Specifications
12
Thermal Design Power (TDP)
12
Case Temperature
12
Thermal Solution Requirements
12
Characterizing the Thermal Solution Requirement
12
Intel ® 5100 Memory Controller Hub Chipset Thermal Specifications
12
Processor Thermal Characterization Parameter Relationships
13
Thermal Metrology
15
MCH Case Measurement
15
Supporting Test Equipment
15
Required Heatsink Thermal Performance
15
Thermal Calibration and Controls
16
IHS Groove
16
Thermocouple Attach Support Equipment
16
IHS Groove Dimensions
17
Thermocouple Conditioning and Preparation
18
Thermocouple Attachment to IHS
18
Orientation of Thermocouple Groove Relative to Package Pin
18
Bending Tip of Thermocouple
18
Securing Thermocouple Wires with Kapton Tape Prior to Attach
19
Thermocouple Bead Placement
20
Positioning Bead on Groove
20
Using 3D Micromanipulator to Secure Bead Location
21
Measuring Resistance between Thermocouple and IHS
21
Curing Process
22
Applying Adhesive on Thermocouple Bead
22
Thermocouple Wire Management
23
Thermocouple Wire Management in Groove
23
Removing Excess Adhesive from IHS
23
Power Simulation Software
24
Reference Thermal Solution
24
Filling Groove with Adhesive
24
Advancedtca* Reference Heatsink
25
Thermal Performance
25
Mechanical Design Envelope
25
Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity
25
Board-Level Components Keepout Dimensions
26
Torsional Clip Heatsink Thermal Solution Assembly
26
Advancedtca* Torsional Clip Heatsink Volumetric Envelope for MCH Heatsink
26
Heatsink Orientation
27
Extruded Heatsink Profiles
27
Mechanical Interface Material
27
Thermal Interface Material
27
Torsional Clip Heatsink Assembly
27
Effect of Pressure on TIM Performance
28
Heatsink Clip
28
Clip Retention Anchors
28
Reliability Guidelines
28
Honeywell* PCM45F TIM Performance as Function of Attach Pressure
28
Compactpci* Reference Heatsink
29
Component Overview
29
Isometric View of the Compactpci* Reference Heatsink
29
Reliability Guidelines
29
Thermal Solution Performance Characteristics
30
Reliability Guidelines
30
Compactpci* Reference Heatsink Thermal Performance
30
Reliability Requirements
30
Mechanical Drawings
31
Mechanical Drawing List
31
Advancedtca* Heatsink Assembly Drawing
32
Advancedtca* Heatsink Drawing
33
Advancedtca* Component Keepout Zone
34
Compactpci* Heatsink Assembly Drawing
35
Compactpci* Heatsink Drawing
36
Compactpci* Component Keepout Zone
37
Torsional Clip Heatsink Clip Drawing
38
TIM2 Drawing
39
Thermal Solution Component Suppliers
40
MCH Torsional Clip Heatsink Thermal Solution
40
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