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FCPGA2 - Processor - 1 x Pentium 4 2.66 GHz
Intel FCPGA2 - Processor - 1 x Pentium 4 2.66 GHz Manuals
Manuals and User Guides for Intel FCPGA2 - Processor - 1 x Pentium 4 2.66 GHz. We have
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Intel FCPGA2 - Processor - 1 x Pentium 4 2.66 GHz manual available for free PDF download: Design Manuallines
Intel FCPGA2 - Processor - 1 x Pentium 4 2.66 GHz Design Manuallines (33 pages)
Thermal Design Guidelines Processor in the FC-PGA2 Package
Brand:
Intel
| Category:
Computer Hardware
| Size: 0.44 MB
Table of Contents
Table of Contents
3
Revision History
5
1 Introduction
7
Document Scope
7
References
7
Definition of Terms
8
2 Importance of Thermal Management
9
3 FC-PGA2 Processor Packaging Technology
11
Figure 3-1. FC-PGA2 Mechanical Specifications
11
Table 3-1. FC-PGA2 Processor Package Dimensions
12
4 Thermal Specifications
13
Processor Case Temperature
13
5 Designing for Thermal Performance
15
Airflow Management
15
Figure 5-1. Example of Air Exchange through a Μatx PC Chassis
15
Recommended Fan Performance and Limitations
16
Bypass
16
Heatsink Solutions and Keep-In Areas
16
Thermal Interface Management
16
Bond Line Thickness
17
Interface Material Area
17
Interface Material Performance
17
Fans
17
Placement
18
Fan Direction
18
Size and Quantity
18
Venting
18
Area and Size
18
Vent Shape
19
6 Alternative Cooling Solutions
21
Ducting
21
Ducting Placement
21
System Components
21
Placement
21
Power
21
7 Thermal Metrology for FC-PGA2 Packaged Processors
23
Thermal Resistance
23
Figure 7-1. Processor-Heatsink Thermal Resistance Relationships
23
Equation 1. Case to Ambient Thermal Resistance
23
Thermal Solution Performance
24
Equation 2. Case to Ambient Thermal Resistance
24
Local-Ambient Temperature Measurement Guidelines
25
Figure 7-2. Local-Ambient Thermocouple Measurement Locations (Passive Heatsink)
25
Local-Ambient Temperature Measurement for a Passive Heatsink
25
Local-Ambient Temperature Measurement for an Active Heatsink
26
Processor Measurements for Thermal Specifications
26
Figure 7-3. Local-Ambient Thermocouple Measurement Locations (Active Heatsink)
26
Processor Case Temperature Measurements
27
Table 7-1. List of Items for Thermocouple Attach
27
Figure 7-4. Locating Geometric Center of Processor
28
Figure 7-5. Thermocouple Preparation
28
Figure 7-6. Thermocouple Adhesive Placement
29
Figure 7-7. Example of Machined Heatsink with Thermocouple Groove
30
Heatsink Preparation
30
About the High Power Application
31
Executing the High Power Application Software
31
Figure 7-8. Example of Dimensioning for Thermocouple Groove
31
Conclusion
33
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