Reference Thermal Solution Performance Targets; Thermal Design And Management Guidelines; System Thermal Environmental Conditions; Reference Heatsink Boundary Conditions And Performance Targets - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual


Thermal Specifications and Design Guidelines
6.1.6

Reference Thermal Solution Performance Targets

Table 6-6
processor. These values serve as guidance for designing a processor compatible
thermal solution. Heatsink design compliance can be determined with thermocouples
and TTVs.
Table 6-6.

Reference Heatsink Boundary Conditions and Performance Targets

Parameter
TDP
T
LA (max)
System height (form
factor)
Heatsink volumetric
Heatsink Technology
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Reference system configuration. 1U = 1.75 inches.
3. Dimensions of reference heatsink do not include socket, processor, or other retention assembly
components.
6.2

Thermal Design and Management Guidelines

6.2.1

System Thermal Environmental Conditions

6.2.1.1 Ambient Temperature
The temperature of the inlet air entering the processor heatsink module is referenced in
this document as the local ambient temperature (T
requirement, rather simply the local ambient temperature upstream from the
processor. It is measured from the air upstream and in close vicinity to the processor
heatsink module. For other cooling systems, the ambient temperature is measured
from the inlet air to the cooling device.
6.2.1.2 Airflow
Airflow should be provided by a system fan or blower in order to cool the processor
package. See the recommended airflow rate for the reference heatsink in
Table 6-7.

Thermal Solution Performance Design Targets and Environment

Parameter
T
LA
Pressure Drop
Altitude
Airflow
Note: Thermal boundary conditions are applied in establishing the processor heatsink cooling solution.
Order Number: 334785-002
provides thermal boundary conditions and performance targets for the
Processor
215W
Maximum Unit
40 °C
137 (0.55) Pa (inch H
Sea-level
9.44 (20) l/s (CFM)
Processor with Fabric
°
40 C
1U
Overall: 80 x 107 x 27 mm (W x L x H)
Cu base with Al fins
). This is not a system
LA
This is the temperature at the processor cooling devices
O) Total pressure drop across the processor cooling devices
2
Thermal solution optimized for performance at sea-level.
De-rate at higher altitudes.
Airflow through the heatsink fins
® ®
Intel Xeon Phi™ Processor x200 Product Family TMSDG
Notes
230W
1
2
3
Table 6-7.
Notes
49