Figure 8.
Common Glass Cloths Used in PCB Manufacture
Note:
Weave types above are for illustration purposes only
Figure 9.
Inhomogeneous Nature of a PCB as Shown in this Cross-Section
Note:
Note the fiber weave bundle and epoxy regions
At high data rates this skew can amount to a substantial fraction of the transmission
unit interval, resulting in an increased common mode voltage and a correspondingly
degraded differential signal
(ACCM) can become a source of increased crosstalk and EMI in the system, or violate
receiver ACCM specifications.
®
Intel
Quark™ SoC X1000
PDG
24
®
Intel
Quark™ SoC X1000—Stack-Up and PCB Considerations
106
106
1080
1080
2116
2116
1652
1652
D -
Epox y only
Fiberglass
w eav e
bundle
(Figure
10). In addition, the resulting common mode signal
2113
2113
7628
7628
D +
June 2014
Order Number: 330258-002US