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14.3
PCB Heatsink Hole Dimensions
Figure 14-33. Hole Dimensions for Passive Heatsink
2.98 mm REF
45 mm
Board
Pin
Spring
Board
NOTES:
The sides of the H-PBGA package are electrically
conductive; traces run out to the edge of the package.
Therefore, no materials are allowed to contact the sides
of this package at any time, including during shock and vibration testing.
Heatsink actual dimensions vary depending on vendor (see Table 21).
Design Guide
25.4
34.798 mm
mm
5.10 mm
Heat Sink
Intel® i960® RM/RN I/O Processor
4 Holes of diameter 3.175 ± 0.0508 mm
48.4632 mm
25.4 mm
*
55 mm
Top View
Side View
Thermal Solutions
Outline of
Passive
Heat Sink
Heat Slug of
80960RM/RN
(over component)
Package:
42.5 mm x 42.5 mm
Clips
Flange uses pins
Heat Slug
Thermal Interface Material
Heat Slug
Balls
A5860-03
55
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