Intel Quark SoC X1000 Design Manual page 8

Hide thumbs Also See for Quark SoC X1000:
Table of Contents

Advertisement

21.6
Guidelines for Component Placement.................................................................. 152
21.6.1 PHY Placement Recommendations........................................................... 152
21.7
MDI Differential-Pair Trace Routing for LAN Design ............................................... 154
21.8
Signal Trace Geometry ..................................................................................... 154
21.9
Trace Length and Symmetry ............................................................................. 157
21.10 Impedance Discontinuities ................................................................................ 157
21.11 Reducing Circuit Inductance .............................................................................. 158
21.12 Signal Isolation ............................................................................................... 158
21.13 Power and Ground Planes ................................................................................. 158
21.14 Traces for Decoupling Capacitors ....................................................................... 161
21.15 Ground Planes under a Magnetics Module............................................................ 161
21.16 Light Emitting Diodes ....................................................................................... 163
21.17 Vibrational Mode.............................................................................................. 163
21.18 Nominal Frequency .......................................................................................... 163
21.19 Frequency Tolerance ........................................................................................ 163
21.20 Troubleshooting Common Physical Layout Issues ................................................. 163
21.21 Power Delivery ................................................................................................ 165
21.22 Routing Guidelines ........................................................................................... 165
22.0 Wireless Modules and Antenna Design Guidelines .................................................. 167
22.1
Introduction .................................................................................................... 167
22.2
WLAN System Integration Considerations............................................................ 167
22.2.1 Antenna Integration into the Platform...................................................... 167
22.2.2 Antenna Coexistence............................................................................. 168
22.2.3 WiFi Module ......................................................................................... 168
22.2.4 WiFi Module Connector Types ................................................................. 169
22.2.5 WiFi Antenna Placement ........................................................................ 169
22.2.6 Antenna Placement ............................................................................... 169
22.2.7 Antenna Cabling ................................................................................... 170
22.2.8 Platform Noise Mitigation ....................................................................... 170
22.2.9 Antenna Material Choices....................................................................... 170
22.3
ZigBee System Integration Considerations .......................................................... 170
22.3.1 ZigBee Antenna Placement..................................................................... 170
A
General Differential Signals Design Guidelines ....................................................... 171
A.1
Introduction .................................................................................................... 171
A.2
General Differential Routing Guidelines ............................................................... 171
A.3
General Differential Length Matching Guidelines ................................................... 171
A.3.1
Length Matching and Length Formulas ..................................................... 171
A.4
General Differential Optimization Guidelines ........................................................ 174
A.4.1
Breakout Example and Guidelines ........................................................... 174
A.4.2
Via Placement and Via Usage Optimization ............................................... 175
A.4.3
Bend Optimization Guidelines ................................................................. 177
A.5
General Differential Reference Planes Guidelines .................................................. 178
B
Exposed Pad* (e-Pad*) Design and SMT Assembly Guide....................................... 181
B.1
Overview ........................................................................................................ 181
B.2
PCB Design Requirements ................................................................................. 181
B.3
Board Mounting Guidelines................................................................................ 183
B.4
Stencil Design ................................................................................................. 183
B.5
Assembly Process Flow ..................................................................................... 184
B.6
Reflow Guidelines ............................................................................................ 185
®
Intel
Quark™ SoC X1000
PDG
8
®
Intel
Quark™ SoC X1000-Contents
Order Number: 330258-002US
June 2014

Advertisement

Table of Contents
loading

Table of Contents