Usb 2.0 Esd Protection Devices; Typical Integrated Diode Array Package - Intel Quark SoC X1000 Design Manual

Electrostatic Discharge (ESD)—Intel
Figure 82.

USB 2.0 ESD Protection Devices

Figure 83.

Typical Integrated Diode Array Package

Proper placement of any ESD protection device is on the data lines between the
common mode choke and the USB connector data pins as shown in
protection devices should be placed as close to the USB connector as possible so that
when ESD strikes occur, the discharges can be quickly absorbed or diverted to the
ground/power plane before it is coupled to another signal path nearby. Proper
placement of ESD protection device can improve the effectiveness of protecting the
system against ESD strikes. Other types of low-capacitance ESD protection devices
may work as well but were not investigated. As with the common mode choke solution,
the Dual Rail Clamp Diode ESD protection device is needed.
June 2014
Order Number: 330258-002US
®
Quark™ SoC X1000
D i o d e
D i o d e
+
D u a l R a i l C l a m p
D i o d e / D i o d e A r r a y
+ 5 V
-
Figure 84. The ESD
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Intel Quark™ SoC X1000
PDG
135