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Follow Precautions for
Mounting, Wiring, and
Cleaning
Observe these precautions to prevent operation failure, malfunctions,
or undesirable effects on product performance.
When mounting modules, observe these precautions.
Use DIN rail that is 35 mm (1.38 in.) wide to mount the module
into the control panel.
Mount modules to DIN rail so that the module does not fall off
the DIN rail, for example, due to vibration.
Leave at least 50 mm (1.96 in.) above and below the module to
allow adequate ventilation and room for wiring for 1791DS-IB8,
1791DS-IB8XOB8, and 1791DS-IB4XOW4 modules.
Leave at least 5 mm (0.6 in.) above and below the module to
allow adequate ventilation and room for wiring for 1732DS-IB8,
1732DS-IB8XOBV4, and 1791DS-IB8XOBV4 modules.
When wiring modules, follow these instructions.
Do not place communication lines and I/O lines in the same
wiring duct or track as high voltage lines.
Wire correctly after confirming the signal names of all terminals.
Do not remove the shield from a module before wiring, but
always remove the shield after completing wiring to be sure of
proper heat dispersion for 1791DS-IB8, 1791DS-IB8XOB8, and
1791DS-IB4XOW4 modules.
Use insulated post terminals (DIN 46228-4 standard) for stranded
wires before connecting the wires.
Tighten screws on communication and I/O connectors securely
using a tightening torque of 0.25...0.3 Nm (2.16...2.59 lb-in).
When cleaning modules, do not use the following.
Thinner
Benzene
Acetone
About the Modules
Publication 1791DS-UM001H-EN-P - April 2009
11
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